Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module - Barako, M. T.; Park, W.; Marconnet, A. M.; Asheghi, M.; Goodson, K. E. (Journal of electronic materials, 2013)
Keywords: Applied sciences; Characterization and Evaluation of Materials; Chemistry and Materials Science; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Conductivity phenomena in semiconductors and insulators; Electronic transport in condensed matter; Electronics; Electronics and Microelectronics; Exact sciences and technology; Heat conductivity; Instrumentation; Materials; Materials Science; Mechanical properties; Optical and Electronic Materials; Physics; Scanning electron microscopy; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solid State Physics; Thermal cycling; Thermoelectric and thermomagnetic effects; Thermoelectric, pyroelectric devices, etc; Thermography; Harman method; Thermoelectric module; figure of merit; infrared microscopy; thermal cycling; Scanning electron microscopy; Electrical conductivity; Thermal cycle; Seebeck effect; Steady state; Thermoelectric properties; Thermoelectric device; Thermoelectric power; Thermal conductivity; Defect; Figure of merit; Thermomechanical stress; Thermal degradation