Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density
The thermal conductivity of low-dielectric-constant (low- k ) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer model based on a microfin geometry and infrared thermometry. Microscale specimens were patterned from blanket films, released from the substrate...
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Published in | Journal of electronic materials Vol. 43; no. 3; pp. 746 - 754 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
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01.03.2014
Springer Springer Nature B.V |
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Abstract | The thermal conductivity of low-dielectric-constant (low-
k
) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer model based on a microfin geometry and infrared thermometry. Microscale specimens were patterned from blanket films, released from the substrate, and subsequently integrated with the experimental setup. Results show that the thermal conductivity of a dense specimen, 0.7 W/mK, can be reduced to as low as 0.1 W/mK by introducing 30% porosity into it. The measured thermal conductivity shows a nonlinear decrease with increasing porosity that approximately follows the porosity-weighted simple medium model for porous materials. Neither the differential effective medium nor the coherent potential model could predict the density dependence of the thermal conductivity. These results suggest that more careful consideration is required for application of generic porous materials modeling to low-
k
dielectrics. |
---|---|
AbstractList | Issue Title: Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan The thermal conductivity of low-dielectric-constant (low-k) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer model based on a microfin geometry and infrared thermometry. Microscale specimens were patterned from blanket films, released from the substrate, and subsequently integrated with the experimental setup. Results show that the thermal conductivity of a dense specimen, 0.7 W/mK, can be reduced to as low as 0.1 W/mK by introducing 30% porosity into it. The measured thermal conductivity shows a nonlinear decrease with increasing porosity that approximately follows the porosity-weighted simple medium model for porous materials. Neither the differential effective medium nor the coherent potential model could predict the density dependence of the thermal conductivity. These results suggest that more careful consideration is required for application of generic porous materials modeling to low-k dielectrics.[PUBLICATION ABSTRACT] The thermal conductivity of low-dielectric-constant (low- k ) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer model based on a microfin geometry and infrared thermometry. Microscale specimens were patterned from blanket films, released from the substrate, and subsequently integrated with the experimental setup. Results show that the thermal conductivity of a dense specimen, 0.7 W/mK, can be reduced to as low as 0.1 W/mK by introducing 30% porosity into it. The measured thermal conductivity shows a nonlinear decrease with increasing porosity that approximately follows the porosity-weighted simple medium model for porous materials. Neither the differential effective medium nor the coherent potential model could predict the density dependence of the thermal conductivity. These results suggest that more careful consideration is required for application of generic porous materials modeling to low- k dielectrics. |
Author | Pulavarthy, R. A. Alam, M. T. King, S. W. Haque, M. A. Bielefeld, J. |
Author_xml | – sequence: 1 givenname: M. T. surname: Alam fullname: Alam, M. T. organization: Mechanical & Nuclear Engineering, Penn State University – sequence: 2 givenname: R. A. surname: Pulavarthy fullname: Pulavarthy, R. A. organization: Mechanical & Nuclear Engineering, Penn State University – sequence: 3 givenname: J. surname: Bielefeld fullname: Bielefeld, J. organization: Logic Technology Development, Intel Corporation – sequence: 4 givenname: S. W. surname: King fullname: King, S. W. organization: Logic Technology Development, Intel Corporation – sequence: 5 givenname: M. A. surname: Haque fullname: Haque, M. A. email: mah37@psu.edu organization: Mechanical & Nuclear Engineering, Penn State University |
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Cites_doi | 10.1088/0957-0233/12/12/306 10.1063/1.3182826 10.1016/j.mee.2007.12.053 10.1103/PhysRevB.48.12581 10.1016/j.mee.2007.01.178 10.1016/j.tsf.2012.11.141 10.1063/1.4784226 10.1088/0143-0807/14/3/006 10.1016/j.mee.2008.12.030 10.1063/1.112933 10.1063/1.4729325 10.1016/S0167-9317(03)00417-9 10.1117/1.JNP.7.073094 10.1111/j.1551-2916.1954.tb20107.x 10.1063/1.1525054 10.1063/1.363923 10.1063/1.1513882 10.1103/PhysRevB.65.094205 10.1063/1.126904 10.1016/j.ijthermalsci.2013.05.010 10.1063/1.1481958 10.1016/j.tsf.2010.03.031 10.1007/978-1-4612-4254-3 10.1038/nmat1153 10.1088/0022-3727/46/4/045308 10.1021/am402046e 10.1103/PhysRevB.46.6131 10.1149/2.021206jss 10.1557/jmr.2012.207 10.1002/sia.2908 10.1111/j.1151-2916.1935.tb19340.x 10.1016/j.microrel.2005.05.016 10.1063/1.1505652 10.1016/j.tca.2005.04.005 10.1063/1.3624583 10.1111/j.1551-2916.1954.tb20108.x 10.1103/PhysRevB.48.12589 |
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Keywords | dielectrics Thermal conductivity porous materials low thin films Porous materials Thermometry Theoretical study low-k dielectrics Thin films Electrical conductivity measurement Modelling Porosity Non linear effect Effective medium model Model potential Permittivity Low k dielectric Heat transfer |
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Snippet | The thermal conductivity of low-dielectric-constant (low-
k
) SiOC:H and SiC:H thin films has been measured as a function of porosity using a heat transfer... Issue Title: Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan The thermal conductivity of... |
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SubjectTerms | Characterization and Evaluation of Materials Chemistry and Materials Science Conductivity Cross-disciplinary physics: materials science; rheology Density Dielectric properties Electronics and Microelectronics Exact sciences and technology Instrumentation Materials Science Measurement techniques Optical and Electronic Materials Physics Porosity Porous materials; granular materials Solid State Physics Specific materials Thermal energy |
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Title | Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density |
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