Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder

According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb–Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb–Sn solders that are near eutectic composition increases with decreasing Pb content. The solders were tested after either stabi...

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Bibliographic Details
Published inJournal of materials research Vol. 16; no. 9; pp. 2644 - 2652
Main Authors Chuang, C. M., Lui, T. S., Chen, L. H.
Format Journal Article
LanguageEnglish
Published New York, USA Cambridge University Press 01.09.2001
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Summary:According to resonant vibration fatigue tests, near-eutectic and Pb-rich hypoeutectic Pb–Sn specimens have higher crack-propagation resistance. The tensile flow stress of Pb–Sn solders that are near eutectic composition increases with decreasing Pb content. The solders were tested after either stabilizing at 373 K or natural aging for 20 days, which gave similar results. The naturally aged specimens show that the crack-propagation resistance increases with increasing aging time. A striated deformation was found to occur in Sn grain of the lower Pb specimen. This phenomenon is correlated with a deterioration of crack-propagation resistance.
Bibliography:ArticleID:05960
ark:/67375/6GQ-PSSKDXK4-V
PII:S0884291400059604
istex:15EC8D68ACAB1E15AC1C576EC5950E682DB1D67C
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0884-2914
2044-5326
DOI:10.1557/JMR.2001.0363