APA (7th ed.) Citation

Chuang, C. M., Lui, T. S., & Chen, L. H. (2001). Effect of lead content on vibration fracture behavior of Pb–Sn eutectic solder. Journal of materials research, 16(9), 2644-2652. https://doi.org/10.1557/JMR.2001.0363

Chicago Style (17th ed.) Citation

Chuang, C. M., T. S. Lui, and L. H. Chen. "Effect of Lead Content on Vibration Fracture Behavior of Pb–Sn Eutectic Solder." Journal of Materials Research 16, no. 9 (2001): 2644-2652. https://doi.org/10.1557/JMR.2001.0363.

MLA (9th ed.) Citation

Chuang, C. M., et al. "Effect of Lead Content on Vibration Fracture Behavior of Pb–Sn Eutectic Solder." Journal of Materials Research, vol. 16, no. 9, 2001, pp. 2644-2652, https://doi.org/10.1557/JMR.2001.0363.