APA (7th ed.) Citation

Cheng, J., Huang, S., Li, Y., Wang, T., Xie, L., & Lu, X. (2020). RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis. Applied surface science, 506, 144668. https://doi.org/10.1016/j.apsusc.2019.144668

Chicago Style (17th ed.) Citation

Cheng, Jie, Shuo Huang, Yang Li, Tongqing Wang, Lile Xie, and Xinchun Lu. "RE (La, Nd and Yb) Doped CeO2 Abrasive Particles for Chemical Mechanical Polishing of Dielectric Materials: Experimental and Computational Analysis." Applied Surface Science 506 (2020): 144668. https://doi.org/10.1016/j.apsusc.2019.144668.

MLA (9th ed.) Citation

Cheng, Jie, et al. "RE (La, Nd and Yb) Doped CeO2 Abrasive Particles for Chemical Mechanical Polishing of Dielectric Materials: Experimental and Computational Analysis." Applied Surface Science, vol. 506, 2020, p. 144668, https://doi.org/10.1016/j.apsusc.2019.144668.