Weibull strength size effect of diamond wire sawn photovoltaic silicon wafers

• Published in: Journal of the European Ceramic Society Vol. 40; no. 15; pp. 5357 - 5368
• Main Authors: Carton, Louise, Riva, Roland, Nélias, Daniel, Fourmeau, Marion
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.12.2020; Elsevier
• Subjects: Chemical Sciences; Diamond wire sawing; Four-line bending; Silicon wafer; Strength size effect; Weibull distribution; Strength size effect; Weibull distribution; Four-line bending; Diamond wire sawing; Silicon wafer

A good comprehension of the mechanical properties of photovoltaic silicon wafers is crucial to maintain low breakage rates during solar cell manufacturing. As brittle material, silicon wafers are theoretically subject to a strength size effect. This study aims at determining whether this effect shou...