An optimal residency-aware scheduling technique for cluster tools with buffer module
Cluster tools provide a flexible, reconfigurable, and efficient environment for several manufacturing processes (e.g., semiconductor manufacturing). A new timing constraint (distinct from a simple deadline), referred to as residency constraint, puts a timing limit on the time that a wafer can stay i...
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Published in | IEEE transactions on semiconductor manufacturing Vol. 17; no. 1; pp. 68 - 73 |
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Main Authors | , |
Format | Journal Article |
Language | English |
Published |
New York, NY
IEEE
01.02.2004
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Abstract | Cluster tools provide a flexible, reconfigurable, and efficient environment for several manufacturing processes (e.g., semiconductor manufacturing). A new timing constraint (distinct from a simple deadline), referred to as residency constraint, puts a timing limit on the time that a wafer can stay in a processing module in a cluster tool. The authors demonstrate that a solution that does not address residency constraints can be found easily. However, when residency constraints are added to the model, the problem becomes complex and a scheduling technique may spend a long time searching for a good solution. Also, in some cases, one may need to decrease throughput to satisfy residency constraints. The authors introduce a new technique to address cluster tool scheduling in the presence of residency constraints. The proposed technique uses a buffer resource for temporarily holding wafers to release other resources such as the robot arm. This resource is usually available in the tool for maintenance reasons. A tradeoff is discussed in using the buffer resource and a scheduling algorithm is presented that will use this resource when it can help to increase throughput under residency constraints. The experiments show that in many cases that are common in semiconductor manufacturing, use of their proposed technique can improve throughput. |
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AbstractList | Cluster tools provide a flexible, reconfigurable, and efficient environment for several manufacturing processes (e.g., semiconductor manufacturing). A new timing constraint (distinct from a simple deadline), referred to as residency constraint, puts a timing limit on the time that a wafer can stay in a processing module in a cluster tool. The authors demonstrate that a solution that does not address residency constraints can be found easily. However, when residency constraints are added to the model, the problem becomes complex and a scheduling technique may spend a long time searching for a good solution. Also, in some cases, one may need to decrease throughput to satisfy residency constraints. The authors introduce a new technique to address cluster tool scheduling in the presence of residency constraints. The proposed technique uses a buffer resource for temporarily holding wafers to release other resources such as the robot arm. This resource is usually available in the tool for maintenance reasons. A tradeoff is discussed in using the buffer resource and a scheduling algorithm is presented that will use this resource when it can help to increase throughput under residency constraints. The experiments show that in many cases that are common in semiconductor manufacturing, use of their proposed technique can improve throughput. A new timing constraint (distinct from a simple deadline), referred to as residency constraint, puts a timing limit on the time that a wafer can stay in a processing module in a cluster tool. |
Author | Hamidzadeh, B. Rostami, S. |
Author_xml | – sequence: 1 givenname: S. surname: Rostami fullname: Rostami, S. organization: Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada – sequence: 2 givenname: B. surname: Hamidzadeh fullname: Hamidzadeh, B. organization: Dept. of Electr. & Comput. Eng., Univ. of British Columbia, Vancouver, BC, Canada |
BackLink | http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15442610$$DView record in Pascal Francis |
BookMark | eNqFkb1rHDEQxUWwIWc7dYo0IpCk2rO-VyqNcT7AxkUutdBKo9yaPeki7WL830eXMxhSJDAgGP3e8GbeGTpJOQFCbylZU0rM5eb73ZoRwteasZ7JV2hFpdQd40KeoBXRRnRKkv41Oqv1gRAqhOlXaHOVcN7P485NuEAdAyT_1LlHVwBXv4WwTGP6iWfw2zT-WgDHXLCfljpDwXPOU8WP47zFwxJj6-xyE8AFOo1uqvDm-T1HPz7fbK6_drf3X75dX912XlAydypwE5tXKoIJXBkdgyJ9Lwc9ODOwGFlkmrvApIBecuPNELjWlKsg-sAMP0efjnP3JTdvdba7sXqYJpcgL9Vqo-ifauTHf5LMCGqIIv8HtVDturyB7_8CH_JSUlvXGkaZIIaKBl0eIV9yrQWi3Zd26vJkKbGH1GxLzR5Ss8fUmuLD81hXvZticcmP9UUmhWCKHny-O3IjALx8MyV7ZfhvEPOgwg |
CODEN | ITSMED |
CitedBy_id | crossref_primary_10_1007_s11771_014_1927_2 crossref_primary_10_1080_00207543_2013_774490 crossref_primary_10_3724_SP_J_1004_2012_00479 crossref_primary_10_1007_s00291_006_0061_4 crossref_primary_10_1109_TASE_2016_2642997 crossref_primary_10_1080_00207540903225205 crossref_primary_10_1177_0959651818789754 crossref_primary_10_3182_20060517_3_FR_2903_00370 crossref_primary_10_1007_s10479_011_0952_x crossref_primary_10_1109_TSM_2019_2910399 |
Cites_doi | 10.1080/07408178808966165 10.1109/ROBOT.2001.933131 10.1109/66.536105 10.1287/mnsc.37.12.1629 10.1109/66.536110 10.1080/05695557608975070 10.1109/TSM.2002.801379 10.1109/70.660860 10.1109/66.311340 10.1109/66.641483 10.1109/70.964662 |
ContentType | Journal Article |
Copyright | 2004 INIST-CNRS Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004 |
Copyright_xml | – notice: 2004 INIST-CNRS – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004 |
DBID | RIA RIE IQODW AAYXX CITATION 7SP 7U5 8FD L7M 7TB FR3 F28 |
DOI | 10.1109/TSM.2003.822725 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 1998-Present IEEE/IET Electronic Library Pascal-Francis CrossRef Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace Mechanical & Transportation Engineering Abstracts Engineering Research Database ANTE: Abstracts in New Technology & Engineering |
DatabaseTitle | CrossRef Solid State and Superconductivity Abstracts Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts Mechanical & Transportation Engineering Abstracts Engineering Research Database ANTE: Abstracts in New Technology & Engineering |
DatabaseTitleList | Solid State and Superconductivity Abstracts Technology Research Database Solid State and Superconductivity Abstracts Solid State and Superconductivity Abstracts |
Database_xml | – sequence: 1 dbid: RIE name: IEEE/IET Electronic Library url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Economics Engineering Applied Sciences |
EISSN | 1558-2345 |
EndPage | 73 |
ExternalDocumentID | 2584927711 10_1109_TSM_2003_822725 15442610 1265769 |
Genre | orig-research |
GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AASAJ ABQJQ ABVLG ACGFO ACGFS ACIWK AENEX AETIX AI. AIBXA AKJIK ALLEH ALMA_UNASSIGNED_HOLDINGS ASUFR ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ H~9 ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 MS~ O9- OCL P2P RIA RIE RIG RNS TN5 VH1 XFK ABPTK IQODW AAYXX CITATION 7SP 7U5 8FD L7M 7TB FR3 F28 |
ID | FETCH-LOGICAL-c410t-6d39f27214d9d3698fd60775b8ba9b2ff2f283ad254e7539c9bd388136d47d293 |
IEDL.DBID | RIE |
ISSN | 0894-6507 |
IngestDate | Fri Aug 16 12:01:12 EDT 2024 Sat Aug 17 02:14:54 EDT 2024 Fri Aug 16 21:06:10 EDT 2024 Thu Oct 10 14:43:05 EDT 2024 Fri Aug 23 03:11:08 EDT 2024 Sun Oct 22 16:04:38 EDT 2023 Wed Jun 26 19:20:33 EDT 2024 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 1 |
Keywords | Buffer Cluster tools Residence time Optimal algorithm Constraint Scheduling Buffer system Robotics Microelectronic fabrication Algorithm performance Manufacturing process System description residency constraints Limit deadline |
Language | English |
License | CC BY 4.0 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c410t-6d39f27214d9d3698fd60775b8ba9b2ff2f283ad254e7539c9bd388136d47d293 |
Notes | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
PQID | 921240914 |
PQPubID | 23500 |
PageCount | 6 |
ParticipantIDs | ieee_primary_1265769 proquest_miscellaneous_28467253 pascalfrancis_primary_15442610 proquest_miscellaneous_29419060 proquest_journals_921240914 proquest_miscellaneous_896196196 crossref_primary_10_1109_TSM_2003_822725 |
PublicationCentury | 2000 |
PublicationDate | 2004-02-01 |
PublicationDateYYYYMMDD | 2004-02-01 |
PublicationDate_xml | – month: 02 year: 2004 text: 2004-02-01 day: 01 |
PublicationDecade | 2000 |
PublicationPlace | New York, NY |
PublicationPlace_xml | – name: New York, NY – name: New York |
PublicationTitle | IEEE transactions on semiconductor manufacturing |
PublicationTitleAbbrev | TSM |
PublicationYear | 2004 |
Publisher | IEEE Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: Institute of Electrical and Electronics Engineers – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref13 ref12 burggraaf (ref2) 1995; 38 ref14 ref11 ref10 bader (ref1) 1990; 33 ref8 ref7 ref9 rostami (ref4) 2000 ref3 ref6 ref5 |
References_xml | – ident: ref12 doi: 10.1080/07408178808966165 – ident: ref8 doi: 10.1109/ROBOT.2001.933131 – year: 2000 ident: ref4 article-title: an optimal periodic scheduling technique for dual-arm robots in cluster tools with process-module residency constraint publication-title: Proceedings of the 29th IEEE Conference on Decision and Control contributor: fullname: rostami – ident: ref7 doi: 10.1109/66.536105 – ident: ref13 doi: 10.1287/mnsc.37.12.1629 – ident: ref6 doi: 10.1109/66.536110 – volume: 33 start-page: 149 year: 1990 ident: ref1 article-title: integrated processing equipment publication-title: Solid State Technol contributor: fullname: bader – ident: ref11 doi: 10.1080/05695557608975070 – ident: ref10 doi: 10.1109/TSM.2002.801379 – ident: ref14 doi: 10.1109/70.660860 – ident: ref5 doi: 10.1109/66.311340 – ident: ref3 doi: 10.1109/66.641483 – volume: 38 start-page: 45 year: 1995 ident: ref2 article-title: coping with the high cost of wafer fabs publication-title: Semiconduct Int contributor: fullname: burggraaf – ident: ref9 doi: 10.1109/70.964662 |
SSID | ssj0014497 |
Score | 1.8419659 |
Snippet | Cluster tools provide a flexible, reconfigurable, and efficient environment for several manufacturing processes (e.g., semiconductor manufacturing). A new... A new timing constraint (distinct from a simple deadline), referred to as residency constraint, puts a timing limit on the time that a wafer can stay in a... |
SourceID | proquest crossref pascalfrancis ieee |
SourceType | Aggregation Database Index Database Publisher |
StartPage | 68 |
SubjectTerms | Applied sciences Blades Buffers Clusters Computer science; control theory; systems Control theory. Systems Electronics Exact sciences and technology Flexible manufacturing systems Job shop scheduling Manufacturing Manufacturing processes Mathematical models Microelectronic fabrication (materials and surfaces technology) Optimal scheduling Robotics Robots Scheduling Semiconductor device manufacture Semiconductor device modeling Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Throughput Time factors Time measurements Timing Wafers |
Title | An optimal residency-aware scheduling technique for cluster tools with buffer module |
URI | https://ieeexplore.ieee.org/document/1265769 https://www.proquest.com/docview/921240914 https://search.proquest.com/docview/28467253 https://search.proquest.com/docview/29419060 https://search.proquest.com/docview/896196196 |
Volume | 17 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9wwEB4Bl9JDS6FVUwr40EMPzZLY3iQ-IgRCSMuFReIW-ZVLIUEkUdX--s7Yuwt9gJByiBQ7cTy25xt75huAL1wKI_LcpeVU2VQ6KdPKK2LCzLSxTjRVCBKbXRRnV_L8enq9Bt9WsTDe--B85id0G87yXWdH2io7zHmB8Fitw3qV8RirtToxkFJFVk8lU0Qd5YLGJ8_U4fxyFog_J6gMS8qJ_UgDhZQq5BCpe-yTJiaz-GddDsrm9C3Mls2MPibfJ-NgJvbXXwyOL_2PLXizQJ3sKA6Td7Dm2214tQxK7rfh9SNewh2YH7Wsw7XkFuugOR7yjv5M9Q997xlaw6idKIidrfhfGSJfZm9GIl1gQ9fd9Iz2d5kZKfsKu-2wgn8PV6cn8-OzdJF-IbUyz4a0cEI12GG5dMqJQlWNK4gwz1RGK8ObhjeITbRDE9Oj0aOsMk6gaEXhZOkQRnyAjbZr_UdglbbOCpVpBMn47tJw7i0iy0oXBAh9Al-XIqnvIstGHayTTNUoPcqVKeoovQR2qEMfisW-TGD_DxE-PJ9KshKzBHaXMq0X07SvFSpuNHBzmcDB6inOLzo00a3vxr7mBND4VDxTQklEVQV-gT1RolJoptL16f-N34XN6BBEXjKfYWO4H_0eYp3B7IdB_hvSd_vL |
link.rule.ids | 315,786,790,802,27955,27956,55107 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9wwEB5ReqA9QAutCE8feuihWZLYm8RHhEDbluXSReIW-ZVLIUEkUdX-embs3YU-QJVyiBQ7cTy25xt75huAD5ngmqepjYuxNLGwQsSlk8SEmShtLK9LHyQ2vcgnl-LL1fhqBT4tY2Gcc975zI3o1p_l29YMtFV2lGY5wmP5Al6ink-KEK21PDMQQgZeTylixB3FnMgnTeTR7NvUU3-OUB0WlBX7kQ7ySVXIJVJ12Ct1SGfx18rs1c3ZBkwXDQ1eJt9HQ69H5tcfHI7_-ydvYH2OO9lxGChvYcU1m7C2CEvuNuH1I2bCLZgdN6zF1eQG66BB7jOP_ozVD3XnGNrDqJ8ojJ0tGWAZYl9mrgeiXWB92153jHZ4mR4o_wq7abGCeweXZ6ezk0k8T8AQG5EmfZxbLmvssFRYaXkuy9rmRJmnS62kzuo6qxGdKItGpkOzRxqpLUfh8tyKwiKQeA-rTdu4bWClMtZwmSiEyfjuQmeZM4gtS5UTJHQRfFyIpLoNPBuVt08SWaH0KFsmr4L0ItiiDn0oFvoygoPfRPjwfCzITkwi2F3ItJpP1K6SqLrRxE1FBIfLpzjD6NhENa4duiojiJaN-TMlpEBcleMX2BMlSomGKl07_278IaxNZtPz6vzzxdddeBXcg8hnZg9W-7vB7SPy6fWBH_D3NUr_Hw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=An+optimal+residency-aware+scheduling+technique+for+cluster+tools+with+buffer+module&rft.jtitle=IEEE+transactions+on+semiconductor+manufacturing&rft.au=Rostami%2C+S.&rft.au=Hamidzadeh%2C+B.&rft.date=2004-02-01&rft.pub=IEEE&rft.issn=0894-6507&rft.eissn=1558-2345&rft.volume=17&rft.issue=1&rft.spage=68&rft.epage=73&rft_id=info:doi/10.1109%2FTSM.2003.822725&rft.externalDocID=1265769 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0894-6507&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0894-6507&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0894-6507&client=summon |