Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline

• Published in: Journal of materials research and technology Vol. 14; pp. 1724 - 1738
• Main Authors: Kim, Myeong In, Lee, Jong-Hyun
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.09.2021; Elsevier
• Subjects: Ag-coated Cu particle; Electroless Ag plating; Particle rearrangement; Particulate preform; Shear strength; Sinter bonding; Shear strength; Electroless Ag plating; Ag-coated Cu particle; Particle rearrangement; Particulate preform; Sinter bonding

Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform to rapidly achieve a bondline with high-temperature sustainability, low-defect structure, and high thermal conductivity. The preform was pre...