Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline

Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform to rapidly achieve a bondline with high-temperature sustainability, low-defect structure, and high thermal conductivity. The preform was pre...

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Published inJournal of materials research and technology Vol. 14; pp. 1724 - 1738
Main Authors Kim, Myeong In, Lee, Jong-Hyun
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.09.2021
Elsevier
Subjects
Ag-coated Cu particle
Electroless Ag plating
Particle rearrangement
Particulate preform
Shear strength
Sinter bonding
Shear strength
Electroless Ag plating
Ag-coated Cu particle
Particle rearrangement
Particulate preform
Sinter bonding
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Abstract Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform to rapidly achieve a bondline with high-temperature sustainability, low-defect structure, and high thermal conductivity. The preform was prepared as a binder-free material by pelletizing 351 nm Cu@Ag particles with 20 wt.% Ag shells. At 350 °C and at pressures of 5 MPa and 10 MPa, the bonding exhibited shear strength values approaching 20 and 24 MPa, respectively, just after 30 s and the pressure increase to 10 MPa accelerated the increase in strength with increasing bonding time. Furthermore, a bondline with a near-full density structure was formed immediately after bonding for only 30 s. The fast sinter bonding and near-full density formation are mainly attributed to the initial strong contact between the particles and the particle rearrangement behavior by the sliding deformation of sintered Ag after dewetting of the Ag shells on the Cu core particles during the pressure-assisted bonding.
AbstractList Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform to rapidly achieve a bondline with high-temperature sustainability, low-defect structure, and high thermal conductivity. The preform was prepared as a binder-free material by pelletizing 351 nm Cu@Ag particles with 20 wt.% Ag shells. At 350 °C and at pressures of 5 MPa and 10 MPa, the bonding exhibited shear strength values approaching 20 and 24 MPa, respectively, just after 30 s and the pressure increase to 10 MPa accelerated the increase in strength with increasing bonding time. Furthermore, a bondline with a near-full density structure was formed immediately after bonding for only 30 s. The fast sinter bonding and near-full density formation are mainly attributed to the initial strong contact between the particles and the particle rearrangement behavior by the sliding deformation of sintered Ag after dewetting of the Ag shells on the Cu core particles during the pressure-assisted bonding.
Author Lee, Jong-Hyun
Kim, Myeong In
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Keywords Shear strength
Electroless Ag plating
Ag-coated Cu particle
Particle rearrangement
Particulate preform
Sinter bonding
Language English
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Snippet Pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate was performed in air using an Ag-coated Cu (Cu@Ag) particulate preform...
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StartPage 1724
SubjectTerms Ag-coated Cu particle
Electroless Ag plating
Particle rearrangement
Particulate preform
Shear strength
Sinter bonding
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Title Die sinter bonding in air using Cu@Ag particulate preform and rapid formation of near-full density bondline
URI https://dx.doi.org/10.1016/j.jmrt.2021.07.059
https://doaj.org/article/16e6dfa3bb4149a5bcf2c1b823f52bc5
Volume 14
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