Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision

• Published in: Machines (Basel) Vol. 3; no. 2; pp. 72 - 92
• Main Authors: Chang, Hsuan-Ting, Pan, Ren-Jie, Peng, Hsiao-Wei
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.06.2015
• Subjects: automatic optical inspection; Boundaries; Calibration; die; Dies; IC packaging; Integrated circuits; Machine vision; Packaging; sawing line; Scratching; wafer; Wafers
• ISSN: 2075-1702; 2075-1702
• DOI: 10.3390/machines3020072

Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies. However, many factors decrease the number of the actually packaged dies, such as die scratching,...