Surface analysis of polysilicon gate etching by pulsed-microwave plasma
The mechanism of highly selective etching by a pulsed-microwave electron-cyclotron-resonance plasma was investigated by analyzing surface-reaction layers formed on nonpatterned poly-Si and SiO2 samples and gate-patterned samples with a gate width of 32 nm. The samples were etched by using an HBr/O2/...
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Published in | Japanese Journal of Applied Physics Vol. 53; no. 3S2; pp. 3 - 1-03DD04-9 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
The Japan Society of Applied Physics
01.03.2014
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Subjects | |
Online Access | Get full text |
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