Surface analysis of polysilicon gate etching by pulsed-microwave plasma

The mechanism of highly selective etching by a pulsed-microwave electron-cyclotron-resonance plasma was investigated by analyzing surface-reaction layers formed on nonpatterned poly-Si and SiO2 samples and gate-patterned samples with a gate width of 32 nm. The samples were etched by using an HBr/O2/...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 53; no. 3S2; pp. 3 - 1-03DD04-9
Main Authors Matsui, Miyako, Morimoto, Michikazu, Ikeda, Norihiko, Yokogawa, Kenetsu
Format Journal Article
LanguageEnglish
Published The Japan Society of Applied Physics 01.03.2014
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