Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load - Dong, Jiayan; Long, Yingli; Jiao, Xiaoxuan; Huang, Yifeng (IEEE access, 2021)
Keywords: Algorithms; Circuit boards; Crack propagation; Degradation; degradation modeling; Electronic packaging; Environmental testing; Excitation spectra; Failure; Failure mechanisms; Form factors; Kurtosis; Load modeling; Monitoring; Morphology; Random vibration; Resistance; Solder joints; Soldered joints; Soldering; Solders; state characterization; Stress; vibration stress; Vibrations; Wiener process