Interface structure characterization of Fe36Ni alloy with ultrasonic soldering - Wei, Jinghui; Deng, Binghui; Gao, Xingqiang; Yan, Jiuchun; Chen, Xiaoguang (Journal of alloys and compounds, 2013)
Keywords: Applied sciences; Brazing. Soldering; Compressive strength; Condensed matter: structure, mechanical and thermal properties; Diffusion; Diffusion in solids; Exact sciences and technology; Fatigue, brittleness, fracture, and cracks; Ferrous alloys; Fracture mechanics; Interface structure and roughness; Intermetallic compounds; Intermetallics; Joining, thermal cutting: metallurgical aspects; Liquid–solid reactions; Mechanical and acoustical properties of condensed matter; Mechanical properties of solids; Metals and alloys; Metals. Metallurgy; Microstructure; Phase transformations; Physics; Scanning electron microscopy; SEM; Silicon; Solders; Solid surfaces and solid-solid interfaces; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Transport properties of condensed matter (nonelectronic); Ultrasonic soldering; Scanning electron microscopy; Metals and alloys; Microstructure; Diffusion; Liquid–solid reactions; Ruptures; Intermetallic compounds; Fillers; Ultrasonic waves; Shear strength; Liquid―solid reactions; Scanning electron microscopy, SEM; Compression strength; Thickness; Interfaces; Interface structure; Solder; Cracks; Fractures; Eutectics; Stress effects; Liquid solid reaction; Soldered joints; Soldering; Double layers