Low-temperature crosslinked soluble polyimide as a dielectric for organic thin-film transistors: enhanced electrical stability and performance
Abstract We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5...
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Published in | JPhys materials Vol. 7; no. 1; pp. 15017 - 15026 |
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Abstract | Abstract
We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (DOCDA) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as the dianhydrides and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FHAB) as a diamine. To further enhance the electrical performance, the SPI thin films were crosslinked with methylated/ethylated (hydroxymethyl)benzoguanamine (HMBG) through a low temperature process at 160 °C. Crosslinking considerably improved the insulating properties, resulting in a substantial reduction in leakage current from 10
−7
A cm
−2
to 10
−9
A cm
−2
at 2.0 MV cm
−1
. When crosslinked SPIs were used as gate dielectrics in OTFTs, device stability and reliability, as measured by the off-current, threshold voltage, and hysteresis, improved significantly. Our results demonstrate the potential of crosslinked SPIs as effective gate dielectric materials for advanced organic thin-film transistors. |
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AbstractList | We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (DOCDA) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as the dianhydrides and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FHAB) as a diamine. To further enhance the electrical performance, the SPI thin films were crosslinked with methylated/ethylated (hydroxymethyl)benzoguanamine (HMBG) through a low temperature process at 160 °C. Crosslinking considerably improved the insulating properties, resulting in a substantial reduction in leakage current from 10−7 A cm−2 to 10−9 A cm−2 at 2.0 MV cm−1. When crosslinked SPIs were used as gate dielectrics in OTFTs, device stability and reliability, as measured by the off-current, threshold voltage, and hysteresis, improved significantly. Our results demonstrate the potential of crosslinked SPIs as effective gate dielectric materials for advanced organic thin-film transistors. We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (DOCDA) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as the dianhydrides and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FHAB) as a diamine. To further enhance the electrical performance, the SPI thin films were crosslinked with methylated/ethylated (hydroxymethyl)benzoguanamine (HMBG) through a low temperature process at 160 °C. Crosslinking considerably improved the insulating properties, resulting in a substantial reduction in leakage current from 10 ^−7 A cm ^−2 to 10 ^−9 A cm ^−2 at 2.0 MV cm ^−1 . When crosslinked SPIs were used as gate dielectrics in OTFTs, device stability and reliability, as measured by the off-current, threshold voltage, and hysteresis, improved significantly. Our results demonstrate the potential of crosslinked SPIs as effective gate dielectric materials for advanced organic thin-film transistors. Abstract We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (DOCDA) and hexafluoroisopropylidene diphthalic anhydride (6FDA) as the dianhydrides and 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FHAB) as a diamine. To further enhance the electrical performance, the SPI thin films were crosslinked with methylated/ethylated (hydroxymethyl)benzoguanamine (HMBG) through a low temperature process at 160 °C. Crosslinking considerably improved the insulating properties, resulting in a substantial reduction in leakage current from 10 −7 A cm −2 to 10 −9 A cm −2 at 2.0 MV cm −1 . When crosslinked SPIs were used as gate dielectrics in OTFTs, device stability and reliability, as measured by the off-current, threshold voltage, and hysteresis, improved significantly. Our results demonstrate the potential of crosslinked SPIs as effective gate dielectric materials for advanced organic thin-film transistors. |
Author | Kim, Cho Long Yoo, Sungmi Won, Jong Chan Kim, Yun Ho Ahn, Taek Kim, Kyeongmin Choi, Seong Hun |
Author_xml | – sequence: 1 givenname: Sungmi surname: Yoo fullname: Yoo, Sungmi organization: Korea Research Institute of Chemical Technology Division of Advanced Materials, 141 Gajeong-ro, Yuseong-gu, Daejeon 34114, Republic of Korea – sequence: 2 givenname: Kyeongmin surname: Kim fullname: Kim, Kyeongmin organization: Kyungsung University Department of Applied Chemistry, 309 Suyeong-ro, Nam-gu, Busan 48434, Republic of Korea – sequence: 3 givenname: Cho Long orcidid: 0009-0002-9498-9077 surname: Kim fullname: Kim, Cho Long organization: Korea Research Institute of Chemical Technology Division of Advanced Materials, 141 Gajeong-ro, Yuseong-gu, Daejeon 34114, Republic of Korea – sequence: 4 givenname: Seong Hun surname: Choi fullname: Choi, Seong Hun organization: Advanced Materials and Chemical Engineering, KRICT school, University of Science and Technology , 217 Gajeong-ro, Yuseong-gu, Daejeon 34113, Republic of Korea – sequence: 5 givenname: Jong Chan orcidid: 0000-0003-3706-7359 surname: Won fullname: Won, Jong Chan organization: Advanced Materials and Chemical Engineering, KRICT school, University of Science and Technology , 217 Gajeong-ro, Yuseong-gu, Daejeon 34113, Republic of Korea – sequence: 6 givenname: Taek surname: Ahn fullname: Ahn, Taek organization: Kyungsung University Department of Applied Chemistry, 309 Suyeong-ro, Nam-gu, Busan 48434, Republic of Korea – sequence: 7 givenname: Yun Ho orcidid: 0000-0002-1722-5623 surname: Kim fullname: Kim, Yun Ho organization: Advanced Materials and Chemical Engineering, KRICT school, University of Science and Technology , 217 Gajeong-ro, Yuseong-gu, Daejeon 34113, Republic of Korea |
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Snippet | Abstract
We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve... We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their... |
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StartPage | 15017 |
SubjectTerms | cross-linking network Crosslinking Diamines Dicarboxylic anhydride Dielectrics Insulation Leakage current Low temperature mobility polyimide polymer dielectric Semiconductor devices Stability Thin film transistors Threshold voltage |
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Title | Low-temperature crosslinked soluble polyimide as a dielectric for organic thin-film transistors: enhanced electrical stability and performance |
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