Embedded Planar Power Inductor in an Organic Interposer for Package-Level DC Power Grid

To realize the basic technology of a package-level dc power grid for the next generation power delivery to large scale integrated circuits (LSIs), two types of planar spiral inductors embedded in an organic interposer, for several tens of megahertz switching power supply integrated in LSI package, h...

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Published inIEEE transactions on magnetics Vol. 50; no. 11; pp. 1 - 4
Main Authors Yazaki, Yuichiro, Ishidate, Kazuma, Hagita, Kazuhiro, Kondo, Yuta, Hattori, Saki, Sonehara, Makoto, Sato, Toshiro, Watanabe, Tetsuro, Seino, Yuto, Matsushita, Nobuhiro
Format Journal Article
LanguageEnglish
Published New York IEEE 01.11.2014
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Coils
Ferrites
Inductors
Magnetic cores
Magnetism
Permeability
Saturation magnetization
Spirals
Carbonyl-iron/epoxy composite
Zn–Fe ferrite
package-level power grid
planar power inductor
Online AccessGet full text
ISSN0018-9464
1941-0069
DOI10.1109/TMAG.2014.2327965

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Abstract To realize the basic technology of a package-level dc power grid for the next generation power delivery to large scale integrated circuits (LSIs), two types of planar spiral inductors embedded in an organic interposer, for several tens of megahertz switching power supply integrated in LSI package, have been proposed. One is a Zn-Fe ferrite core spiral inductor, and another is a hybrid core spiral inductor, with quasi closed magnetic circuit consisting of the bottom Zn-Fe ferrite core and top carbonyl-iron/epoxy composite core. In this paper, the two types of planar spiral inductors have been fabricated and evaluated. From the experimental results, it was found that the hybrid core planar spiral inductor exhibited higher Q-factor and larger rating dc current than the Zn-Fe ferrite core inductor.
AbstractList To realize the basic technology of a package-level dc power grid for the next generation power delivery to large scale integrated circuits (LSIs), two types of planar spiral inductors embedded in an organic interposer, for several tens of megahertz switching power supply integrated in LSI package, have been proposed. One is a Zn-Fe ferrite core spiral inductor, and another is a hybrid core spiral inductor, with quasi closed magnetic circuit consisting of the bottom Zn-Fe ferrite core and top carbonyl-iron/epoxy composite core. In this paper, the two types of planar spiral inductors have been fabricated and evaluated. From the experimental results, it was found that the hybrid core planar spiral inductor exhibited higher \(Q\) -factor and larger rating dc current than the Zn-Fe ferrite core inductor.
Author Hagita, Kazuhiro
Ishidate, Kazuma
Kondo, Yuta
Sonehara, Makoto
Yazaki, Yuichiro
Seino, Yuto
Hattori, Saki
Watanabe, Tetsuro
Matsushita, Nobuhiro
Sato, Toshiro
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Cites_doi 10.1109/20.104389
10.1109/JSSC.2004.842837
10.1109/JSSC.2007.906204
10.1541/ieejfms.131.949
10.1109/TMAG.2013.2250925
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Issue 11
Keywords Carbonyl-iron/epoxy composite
Zn–Fe ferrite
package-level power grid
planar power inductor
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SubjectTerms Coils
Ferrites
Inductors
Magnetic cores
Magnetism
Permeability
Saturation magnetization
Spirals
Title Embedded Planar Power Inductor in an Organic Interposer for Package-Level DC Power Grid
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