Physical properties of an oxide photoresist film for submicron pattern lithography
The minimum etched pits of 300nm diameter and the trenches of 300nm width with a 50nm depth for both geometries are prepared in the GeSbSn oxide photoresist on the silicon substrates. The lithographic patterns are recorded by direct laser writing, using a 405nm laser diode and 0.9 numerical aperture...
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Published in | Thin solid films Vol. 542; pp. 409 - 414 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
02.09.2013
Elsevier |
Subjects | |
Online Access | Get full text |
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