Physical properties of an oxide photoresist film for submicron pattern lithography

The minimum etched pits of 300nm diameter and the trenches of 300nm width with a 50nm depth for both geometries are prepared in the GeSbSn oxide photoresist on the silicon substrates. The lithographic patterns are recorded by direct laser writing, using a 405nm laser diode and 0.9 numerical aperture...

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Bibliographic Details
Published inThin solid films Vol. 542; pp. 409 - 414
Main Authors Chiang, Donyau, Chang, Chun-Ming, Chen, Shi-Wei, Yang, Chin-Tien, Hsueh, Wen-Jeng
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 02.09.2013
Elsevier
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