Dynamical cooling of semiconductor by contact layer

• Published in: International journal of heat and mass transfer Vol. 48; no. 14; pp. 2922 - 2925
• Main Authors: Lipnicki, Zygmunt, Król, Fabian
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 01.07.2005; Elsevier
• Subjects: Condensed matter: structure, mechanical and thermal properties; Exact sciences and technology; Other topics in thermal properties of condensed matter; Physics; Thermal properties of condensed matter; Thermal properties; Temperature distribution; Cooling; Semiconductor materials; Transition elements; Thermal contacts; Analytical method; Dynamic properties; Solid-solid interfaces; Copper; Heat transfer

The subject of this paper is the presentation of a simple theoretical model of cooling of a semiconductor. The problem of the unsteady behaviour both of the semiconductor and of the cold plate that are in touch by the contact layer was studied analytically. The influence of the parameters of the mat...