Dynamical cooling of semiconductor by contact layer

The subject of this paper is the presentation of a simple theoretical model of cooling of a semiconductor. The problem of the unsteady behaviour both of the semiconductor and of the cold plate that are in touch by the contact layer was studied analytically. The influence of the parameters of the mat...

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Published inInternational journal of heat and mass transfer Vol. 48; no. 14; pp. 2922 - 2925
Main Authors Lipnicki, Zygmunt, Król, Fabian
Format Journal Article
LanguageEnglish
Published Oxford Elsevier Ltd 01.07.2005
Elsevier
Subjects
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Other topics in thermal properties of condensed matter
Physics
Thermal properties of condensed matter
Thermal properties
Temperature distribution
Cooling
Semiconductor materials
Transition elements
Thermal contacts
Analytical method
Dynamic properties
Solid-solid interfaces
Copper
Heat transfer
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Abstract The subject of this paper is the presentation of a simple theoretical model of cooling of a semiconductor. The problem of the unsteady behaviour both of the semiconductor and of the cold plate that are in touch by the contact layer was studied analytically. The influence of the parameters of the materials and the cooling conditions was investigated. The results in the form of an analytical formula and graphs are presented and the heat stream is compared with the experimental results.
AbstractList The subject of this paper is the presentation of a simple theoretical model of cooling of a semiconductor. The problem of the unsteady behaviour both of the semiconductor and of the cold plate that are in touch by the contact layer was studied analytically. The influence of the parameters of the materials and the cooling conditions was investigated. The results in the form of an analytical formula and graphs are presented and the heat stream is compared with the experimental results.
Author Król, Fabian
Lipnicki, Zygmunt
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10.1016/S0017-9310(98)00338-X
10.1016/S0017-9310(98)00333-0
10.1016/S0026-2692(00)00057-4
10.1016/S0017-9310(02)00531-8
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Issue 14
Keywords Thermal properties
Temperature distribution
Cooling
Semiconductor materials
Transition elements
Thermal contacts
Analytical method
Dynamic properties
Solid-solid interfaces
Copper
Heat transfer
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Loulou, Artyukhin, Bardon (bib6) 1999; 42
Wang, Muller (bib1) 2000; 31
Darabi, Ekula (bib2) 2003; 34
Lipnicki (bib4) 2003
Loulou, Artyukhin, Bardon (bib7) 1999; 42
Lipnicki (10.1016/j.ijheatmasstransfer.2005.02.011_bib4) 2003
Darabi (10.1016/j.ijheatmasstransfer.2005.02.011_bib2) 2003; 34
Furmański (10.1016/j.ijheatmasstransfer.2005.02.011_bib5) 2002
Loulou (10.1016/j.ijheatmasstransfer.2005.02.011_bib7) 1999; 42
Wang (10.1016/j.ijheatmasstransfer.2005.02.011_bib1) 2000; 31
10.1016/j.ijheatmasstransfer.2005.02.011_bib3
Loulou (10.1016/j.ijheatmasstransfer.2005.02.011_bib6) 1999; 42
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SubjectTerms Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Other topics in thermal properties of condensed matter
Physics
Thermal properties of condensed matter
Title Dynamical cooling of semiconductor by contact layer
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