Effect of solidification on solder bump formation in solder jet process： Simulation and experiment - 田德文 王春青 田艳红 (Transactions of Nonferrous Metals Society of China, 2008)
Keywords: simulation; solder bump; solder jet; solidification; VOF; volume of fluid(VOF); 焊接喷射; 焊接技术; 焊接碰撞; volume of fluid(VOF); solder bump; solder jet; solidification; simulation