A review of techniques for polishing and planarizing chemically vapor-deposited (CVD) diamond films and substrates

• Published in: Diamond and related materials Vol. 8; no. 7; pp. 1198 - 1213
• Main Authors: Malshe, A.P, Park, B.S, Brown, W.D, Naseem, H.A
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.07.1999; Elsevier
• Subjects: Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.); Cross-disciplinary physics: materials science; rheology; Diamond; Exact sciences and technology; Materials science; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Planarizing; Polishing; Review; Surface treatments; Polishing; Diamond; Review; Planarizing; CVD; State of the art; Planarization; Reviews; Films; Nonmetals; Diamonds; Roughness; Surfaces; Surface treatments; Substrates
• ISSN: 0925-9635; 1879-0062
• DOI: 10.1016/S0925-9635(99)00088-6

State-of-the-art polycrystalline chemically vapor-deposited (CVD) diamond films and substrates have rough surfaces and non-uniform thicknesses which can adversely affect their application. Polishing and planarization can be used to remedy these drawbacks. In recent years, many polishing and planarization techniques have been reported, each having technological advantages and disadvantages. A specific polishing technique should be chosen based on these advantages and disadvantages, depending on the particular CVD diamond film application. Polishing and planarization techniques are reviewed in this paper. Parameters considered include polishing rate, surface finish requirements, and economic impact. To aid in the understanding and evaluation of diamond polishing techniques for applications, polishing mechanisms are also reviewed. Finally, CVD diamond applications and their surface roughness requirements are presented.