Effects of shrinkage on conductivity of isotropic conductive adhesives

• Published in: International journal of adhesion and adhesives Vol. 20; no. 3; pp. 189 - 193
• Main Authors: Lu, Daoqiang, Wong, C.P
• Format: Journal Article
• Language: English
• Published: Oxford Elsevier Ltd 2000; Elsevier
• Subjects: Applied sciences; Composites; Cure shrinkage; Establishment of conductivity; Exact sciences and technology; Forms of application and semi-finished materials; Isotropic conductive adhesives; Polymer industry, paints, wood; Technology of polymers; Cure shrinkage; Establishment of conductivity; Isotropic conductive adhesives; Electrical conductivity; Electrical properties; Temperature effect; Epoxy resin; Organic anhydride; Shrinkage; Experimental study; Metal particle; Property processing relationship; Composite material; Silver; Curing(plastics); Adhesive

Our previous study proved that intimate contact between conductive fillers caused by resin cure shrinkage, rather than lubricant removal, was the main mechanism for establishment of conductivity of isotropic conductive adhesives (ICAs). The purpose of the present study was to investigate the changes...