Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu–Al alloys during thermal annealing

• Published in: Journal of materials research Vol. 26; no. 3; pp. 407 - 415
• Main Authors: An, X.H., Qu, S., Wu, S.D., Zhang, Z.F.
• Format: Journal Article
• Language: English
• Published: New York, USA Cambridge University Press 14.02.2011; Springer International Publishing; Springer Nature B.V
• Subjects: Alloys; Annealing; Applied and Technical Physics; Biomaterials; Deformation; Ductility; Grain boundaries; Grain size; Inorganic Chemistry; Localization; Materials Engineering; Materials research; Materials Science; Mechanical properties; Microstructure; Nanotechnology; Temperature

Effects of stacking fault energy (SFE) on the thermal stability and mechanical properties of nanostructured (NS) Cu–Al alloys during thermal annealing were investigated in this study. Compared with NS Cu–5at.%Al alloy with the higher SFE, NS Cu–8at.%Al alloy exhibits the lower critical temperatures...