Study of microstructure evolution and properties of Cu-Fe microcomposites produced by a pre-alloyed powder method

• Published in: Materials & Design Vol. 126; pp. 64 - 72
• Main Authors: Wang, Fenglin, Wakoh, Kimio, Li, Yunping, Ito, Shun, Yamanaka, Kenta, Koizumi, Yuichiro, Chiba, Akihiko
• Format: Journal Article
• Language: English; Japanese
• Published: Elsevier Ltd 15.07.2017; Elsevier BV
• Subjects: Cu-Fe microcomposite; Electrical conductivity; Hot consolidation; In situ technique; Microstructure evolution; Strength; Cu-Fe microcomposite; Hot consolidation; Electrical conductivity; In situ technique; Strength; Microstructure evolution

In this work, Cu-based microcomposites were fabricated by powder metallurgy of gas-atomized Cu-15wt% Fe alloy powder, followed by drawing to various strains. The microstructure evolution and the resultant mechanical and electrical properties were investigated by scanning electron microscopy, electro...