Micromachined variable capacitors with wide tuning range

In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of...

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Published inSensors and actuators. A, Physical Vol. 104; no. 3; pp. 299 - 305
Main Authors Xiao, Zhixiong, Peng, Wuyong, Wolffenbuttel, R.F, Farmer, K.R
Format Journal Article Conference Proceeding
LanguageEnglish
Published Lausanne Elsevier B.V 15.05.2003
Elsevier Science
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Abstract In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal.
AbstractList In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal.
Ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290 percent tuning range, then a linear region that achieves an additional 310 percent, making the total tuning range about 600 percent. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205 percent tuning range, then a linear region that achieves an additional 37 percent, making its total tuning range about 242 percent. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal.
In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal.
Author Peng, Wuyong
Xiao, Zhixiong
Wolffenbuttel, R.F
Farmer, K.R
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Issue 3
Keywords Capacitors
Silicon wafers
SU-8
Parallel plate capacitor
Ultrathin films
SU-8 groups
Microelectronic fabrication
Reactive ion etching
Wafers
Micromachining
Silicon
Experimental study
Microelectromechanical device
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  year: 1997
  ident: 10.1016/S0924-4247(03)00048-7_BIB12
  article-title: One-chip integrated resonance circuit with a capacitive pressure sensor
  publication-title: J. Micromech. Microeng.
  doi: 10.1088/0960-1317/7/3/025
  contributor:
    fullname: Husák
– ident: 10.1016/S0924-4247(03)00048-7_BIB10
– ident: 10.1016/S0924-4247(03)00048-7_BIB15
– ident: 10.1016/S0924-4247(03)00048-7_BIB17
SSID ssj0003377
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Snippet In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring,...
Ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual...
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StartPage 299
SubjectTerms Applied sciences
Capacitors
Circuits and circuit components
Circuits ans circuit components
Electrical and electronic components, instruments and techniques
Electronics
Exact sciences and technology
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Micro- and nanoelectromechanical devices (mems/nems)
Microelectronic fabrication (materials and surfaces technology)
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon wafers
SU-8
Title Micromachined variable capacitors with wide tuning range
URI https://dx.doi.org/10.1016/S0924-4247(03)00048-7
https://search.proquest.com/docview/27840879
https://search.proquest.com/docview/27846043
Volume 104
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