Micromachined variable capacitors with wide tuning range
In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of...
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Published in | Sensors and actuators. A, Physical Vol. 104; no. 3; pp. 299 - 305 |
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Main Authors | , , , |
Format | Journal Article Conference Proceeding |
Language | English |
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Lausanne
Elsevier B.V
15.05.2003
Elsevier Science |
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Abstract | In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have
Q factors around 100 at 1
MHz owing to the use of silicon electrodes other than lower resistivity metal. |
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AbstractList | In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have
Q factors around 100 at 1
MHz owing to the use of silicon electrodes other than lower resistivity metal. Ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290 percent tuning range, then a linear region that achieves an additional 310 percent, making the total tuning range about 600 percent. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205 percent tuning range, then a linear region that achieves an additional 37 percent, making its total tuning range about 242 percent. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal. In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. The SU-8 bonding replaces the use of expensive SOI wafers and enables a more flexible design. The thick SU-8 also decreases the parasitic substrate capacitance. Due to the presence of the bumpers, our variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. Our variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have Q factors around 100 at 1 MHz owing to the use of silicon electrodes other than lower resistivity metal. |
Author | Peng, Wuyong Xiao, Zhixiong Wolffenbuttel, R.F Farmer, K.R |
Author_xml | – sequence: 1 givenname: Zhixiong surname: Xiao fullname: Xiao, Zhixiong email: xiao@adm.njit.edu organization: New Jersey Institute of Technology, Microelectronics Research Center, 121 Summit Street, Rm 200, Newark, NJ 07102, USA – sequence: 2 givenname: Wuyong surname: Peng fullname: Peng, Wuyong organization: New Jersey Institute of Technology, Microelectronics Research Center, 121 Summit Street, Rm 200, Newark, NJ 07102, USA – sequence: 3 givenname: R.F surname: Wolffenbuttel fullname: Wolffenbuttel, R.F organization: Delft University of Technology, ITS/Et, DIMES/Lab. EI, Mekelweg 4, 2628 CD Delft, The Netherlands – sequence: 4 givenname: K.R surname: Farmer fullname: Farmer, K.R organization: New Jersey Institute of Technology, Microelectronics Research Center, 121 Summit Street, Rm 200, Newark, NJ 07102, USA |
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Cites_doi | 10.1109/55.753754 10.1109/84.365370 10.31438/trf.hh1996.20 10.1049/el:19940159 10.1049/el:19970628 10.1109/84.623115 10.31438/trf.hh1998.29 10.1109/22.883875 10.31438/trf.hh1994.29 10.31438/trf.hh1998.67 10.1109/UGIM.2001.960320 10.31438/trf.hh2000.62 10.1002/(SICI)1099-047X(199907)9:4<362::AID-MMCE7>3.0.CO;2-H 10.1088/0960-1317/10/4/201 10.1088/0960-1317/7/3/025 |
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Keywords | Capacitors Silicon wafers SU-8 Parallel plate capacitor Ultrathin films SU-8 groups Microelectronic fabrication Reactive ion etching Wafers Micromachining Silicon Experimental study Microelectromechanical device |
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Snippet | In this paper, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring,... Ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching (DRIE) technology have been combined for the fabrication of folded spring, dual... |
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SubjectTerms | Applied sciences Capacitors Circuits and circuit components Circuits ans circuit components Electrical and electronic components, instruments and techniques Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Micro- and nanoelectromechanical devices (mems/nems) Microelectronic fabrication (materials and surfaces technology) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon wafers SU-8 |
Title | Micromachined variable capacitors with wide tuning range |
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