Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th and Th , which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrentl...

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Published inSensors (Basel, Switzerland) Vol. 24; no. 11; p. 3547
Main Authors Bodić, Milan Z, Aleksić, Stanko O, Rajs, Vladimir M, Damnjanović, Mirjana S, Kisić, Milica G
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 31.05.2024
MDPI
Subjects
chip thermistors
Epoxy resins
heat transfer
Semiconductors
Temperature
Temperature measurements
thermal junction
chip thermistors
heat transfer
thermal junction
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Abstract Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th and Th , which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B of thermistor resistance was determined. After that, a self-heating current I of the input thermistor was measured vs. supply voltage U and ambient temperature T as a parameter. Input resistance R was determined as a ratio of U and I while output thermistor resistance R was measured by a multimeter concurrently with the current I . Temperatures T and T of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
AbstractList Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th and Th , which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B of thermistor resistance was determined. After that, a self-heating current I of the input thermistor was measured vs. supply voltage U and ambient temperature T as a parameter. Input resistance R was determined as a ratio of U and I while output thermistor resistance R was measured by a multimeter concurrently with the current I . Temperatures T and T of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self–heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self-heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self-heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th[sub.1] and Th[sub.2], which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th[sub.1] generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th[sub.2] receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B[sub.10/30] of thermistor resistance was determined. After that, a self–heating current I[sub.1] of the input thermistor was measured vs. supply voltage U and ambient temperature T[sub.a] as a parameter. Input resistance R[sub.1] was determined as a ratio of U and I[sub.1] while output thermistor resistance R[sub.2] was measured by a multimeter concurrently with the current I[sub.1]. Temperatures T[sub.1] and T[sub.2] of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th 1 and Th 2 , which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th 1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th 2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B 10/30 of thermistor resistance was determined. After that, a self–heating current I 1 of the input thermistor was measured vs. supply voltage U and ambient temperature T a as a parameter. Input resistance R 1 was determined as a ratio of U and I 1 while output thermistor resistance R 2 was measured by a multimeter concurrently with the current I 1 . Temperatures T 1 and T 2 of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.
Audience Academic
Author Bodić, Milan Z
Rajs, Vladimir M
Aleksić, Stanko O
Damnjanović, Mirjana S
Kisić, Milica G
AuthorAffiliation 2 Institute of Nuclear Sciences—INN Vinca, 11351 Belgrade, Serbia
1 Faculty of Technical Sciences, University of Novi Sad, 21102 Novi Sad, Serbia mirad@uns.ac.rs (M.S.D.)
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Keywords chip thermistors
heat transfer
thermal junction
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Snippet Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It...
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StartPage 3547
SubjectTerms chip thermistors
Epoxy resins
heat transfer
Semiconductors
Temperature
Temperature measurements
thermal junction
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Title Thermally Coupled NTC Chip Thermistors: Their Properties and Applications
URI https://www.ncbi.nlm.nih.gov/pubmed/38894338
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