APA (7th ed.) Citation

Rao, C., Wang, T., Wang, J., Liu, Y., & Lu, X. (2016). Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization. Microelectronic engineering, 151, 38-46. https://doi.org/10.1016/j.mee.2015.12.004

Chicago Style (17th ed.) Citation

Rao, Can, Tongqing Wang, Jie Wang, Yuhong Liu, and Xinchun Lu. "Improvement of via Dishing and Non-uniformity in TSV Chemical Mechanical Planarization." Microelectronic Engineering 151 (2016): 38-46. https://doi.org/10.1016/j.mee.2015.12.004.

MLA (9th ed.) Citation

Rao, Can, et al. "Improvement of via Dishing and Non-uniformity in TSV Chemical Mechanical Planarization." Microelectronic Engineering, vol. 151, 2016, pp. 38-46, https://doi.org/10.1016/j.mee.2015.12.004.