A novel approach for development of printed circuit board from biofiber based composites
Over past few decades, the electronic boards density and performance are enhanced by entrenching the components in the interior surfaces of the printed circuit boards (PCBs).The worthiness of this novel innovation has to be probed to warranty the functioning of electronic boards acquiesced to callou...
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| Published in | Polymer composites Vol. 41; no. 11; pp. 4550 - 4558 |
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| Main Authors | , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Hoboken, USA
John Wiley & Sons, Inc
01.11.2020
Blackwell Publishing Ltd |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Over past few decades, the electronic boards density and performance are enhanced by entrenching the components in the interior surfaces of the printed circuit boards (PCBs).The worthiness of this novel innovation has to be probed to warranty the functioning of electronic boards acquiesced to callous environments. In this study, a novel advancement concentrating on the development of bio‐based materials for the PCB applications has been documented. The bio‐based composite from rice husk‐epoxy resin could impendingly substitute the conventional synthetic fiber reinforced epoxy composites in PCB applications. The essential properties of biocomposites were assessed such as tensile and bending properties, dielectric property, thermal properties, moisture absorption, microdrilling, biodegradability, and flammability. Results obtained found that, these biocomposites were promising for PCB application. |
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| AbstractList | Over past few decades, the electronic boards density and performance are enhanced by entrenching the components in the interior surfaces of the printed circuit boards (PCBs).The worthiness of this novel innovation has to be probed to warranty the functioning of electronic boards acquiesced to callous environments. In this study, a novel advancement concentrating on the development of bio‐based materials for the PCB applications has been documented. The bio‐based composite from rice husk‐epoxy resin could impendingly substitute the conventional synthetic fiber reinforced epoxy composites in PCB applications. The essential properties of biocomposites were assessed such as tensile and bending properties, dielectric property, thermal properties, moisture absorption, microdrilling, biodegradability, and flammability. Results obtained found that, these biocomposites were promising for PCB application. |
| Author | Bharath, Kurki N. Siengchin, Suchart Sanjay, Mavinkere R. Gowda, Thyavihalli G. Y. Madhu, Puttegowda Verma, Akarsh |
| Author_xml | – sequence: 1 givenname: Kurki N. surname: Bharath fullname: Bharath, Kurki N. organization: G M Institute of Technology – sequence: 2 givenname: Puttegowda surname: Madhu fullname: Madhu, Puttegowda organization: Malnad College of Engineering – sequence: 3 givenname: Thyavihalli G. Y. surname: Gowda fullname: Gowda, Thyavihalli G. Y. organization: King Mongkut's University of Technology North Bangkok – sequence: 4 givenname: Akarsh orcidid: 0000-0003-3891-5268 surname: Verma fullname: Verma, Akarsh organization: Indian Institute of Technology – sequence: 5 givenname: Mavinkere R. orcidid: 0000-0001-8745-9532 surname: Sanjay fullname: Sanjay, Mavinkere R. email: mcemrs@gmail.com organization: King Mongkut's University of Technology North Bangkok – sequence: 6 givenname: Suchart orcidid: 0000-0002-6635-5686 surname: Siengchin fullname: Siengchin, Suchart organization: King Mongkut's University of Technology North Bangkok |
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| SubjectTerms | Biodegradability Biomedical materials Circuit boards composites Dielectric properties epoxy Epoxy resins Fiber composites Fiber reinforced polymers Flammability Microdrilling Moisture absorption PCB Polymer matrix composites Printed circuits rise husk Synthetic fibers Thermodynamic properties |
| Title | A novel approach for development of printed circuit board from biofiber based composites |
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