An addition-curable hybrid phenolic resin containing silicon and boron with improved thermal stability

• Published in: Polymer degradation and stability Vol. 189; p. 109599
• Main Authors: Du, Youpei, Xia, Yu, Luo, Zhenhua, Yuan, Wenjie, Xu, Kongli, Wang, Qian, Zhou, Heng, Guo, Ying, Li, Hao, Zhao, Tong
• Format: Journal Article
• Language: English
• Published: London Elsevier Ltd 01.07.2021; Elsevier BV
• Subjects: Addition cure; Boron; Condensates; Condensation; Condensation resins; degradation; Epoxy resins; Esterification; formaldehyde; NMR spectroscopy; Novolacs; nuclear magnetic resonance spectroscopy; Phenolic resin; Phenolic resins; Resins; Silicon; Synergistic effect; Synergistic hybrid; Thermal stability; Weight; X ray photoelectron spectroscopy; Phenolic resin; Synergistic hybrid; Thermal stability; Addition cure

•Vinyltrimethoxysiloxane (VTMS) acting as both silicon source and addition-cure group was successfully introduced into phenolic resin.•The characterization of FT-IR, Raman, SEM/SEM-EDX, XPS, and solid-state NMR spectroscopy to develop a detailed understanding to confirm the effectiveness of borosili...