Creep damage study at powercycling of lead-free surface mount device

• Published in: Computational materials science Vol. 45; no. 3; pp. 638 - 645
• Main Authors: Hegde, Pradeep, Whalley, David C., Silberschmidt, Vadim V.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 01.05.2009; Elsevier
• Subjects: Applied sciences; Brazing. Soldering; Creep analysis; Exact sciences and technology; Joining, thermal cutting: metallurgical aspects; Lead-free solder; Metals. Metallurgy; Powercycling; Powercycling; 85.40.Bh; Lead-free solder; 71.15.Dx; Creep analysis; Fatigue life; Creep; Fatigue; Fatigue fracture; Finite element method; Surface mount technology; Soldered joint; Lead free solder; Reliability; Soldering; Melting point; Damaging

Soldering is extensively used to assemble electronic components to printed circuit boards or chips to a substrate in microelectronic devices. These solder joints serve as mechanical, thermal and electrical interconnections, therefore, their integrity is a key reliability concern. However, newly intr...