APA (7th ed.) Citation

Jang, S., Jeong, H., Yuh, M., & Park, J. (2015). Effect of surfactant on package substrate in chemical mechanical planarization. International Journal of Precision Engineering and Manufacturing-Green Technology, 2(1), 2(1), 59-63. https://doi.org/10.1007/s40684-015-0008-9

Chicago Style (17th ed.) Citation

Jang, Soocheon, Haedo Jeong, Minjong Yuh, and Jaehong Park. "Effect of Surfactant on Package Substrate in Chemical Mechanical Planarization." International Journal of Precision Engineering and Manufacturing-Green Technology, 2(1) 2, no. 1 (2015): 59-63. https://doi.org/10.1007/s40684-015-0008-9.

MLA (9th ed.) Citation

Jang, Soocheon, et al. "Effect of Surfactant on Package Substrate in Chemical Mechanical Planarization." International Journal of Precision Engineering and Manufacturing-Green Technology, 2(1), vol. 2, no. 1, 2015, pp. 59-63, https://doi.org/10.1007/s40684-015-0008-9.