Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

• Published in: Micromachines (Basel) Vol. 14; no. 11; p. 2053
• Main Authors: Tian, Fangxin, Wang, Tongqing, Lu, Xinchun
• Format: Journal Article
• Language: English
• Published: Basel MDPI AG 01.11.2023
• Subjects: Aluminum; Chemical-mechanical polishing; Design optimization; endpoint detection; Kinematics; Lasers; Methods; Morphology; Nonuniformity; Optical measurement; optical trace; Optics; Process controls; Sensors; Thin films

Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement sy...