Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications

• Published in: IEEE transactions on advanced packaging Vol. 33; no. 2; pp. 428 - 432
• Main Authors: Jing Zhang, Ramana, Pamidighantam V, Chandrappan, Jayakrishnan, Chee Wei Tan, Yi Yoon Chai, Yee Mong Khoo, Wei Liang Teo, Shing, John Lau Hon, Gomex, Philbert Oliver, Ting Wang, Ramkumar, V M
• Format: Journal Article
• Language: English
• Published: Piscataway, NJ IEEE 01.05.2010; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Assembly; Circuit properties; Design. Technologies. Operation analysis. Testing; Electric, optical and optoelectronic circuits; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Extinction ratio; High speed; High speed optical techniques; Integrated circuits; Integrated optics. Optical fibers and wave guides; Links; low-cost package; Noise levels; Optical and optoelectronic circuits; Optical design; Optical fibers; Optical receivers; Optical subassembly; Optical transmitters; Optoelectronic devices; plastic optical fiber; Plastics; Printed circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Subassembly; Transceivers; Transmitters; Integrated optics; plastic optical fiber; high speed; Printed circuit board; Electrooptical device; Optical transmitters; Optical subassembly; Transceiver; Extinction index; Self aligned technology; Electronic packaging; Optical receiver; low-cost package; Vertical alignment; Printed circuit; Cost lowering; Optical fiber

A low-cost optical subassembly design for large core fiber transceiver is presented. The complete transceiver module is realized by assembling the low-cost optical subassembly directly on the transceiver functional printed circuit board. -7 dBm optical power output and 6 dB extinction ratio are achi...