Comprehensive Review on Amorphous Oxide Semiconductor Thin Film Transistor

Oxide materials are one of the most advanced key technology in the thin film transistors (TFTs) for the high-end of device applications. Amorphous oxide semiconductors (AOSs) have leading technique for flat panel display, active matrix organic light emitting display, active matrix liquid crystal dis...

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Published inTransactions on electrical and electronic materials Vol. 21; no. 3; pp. 235 - 248
Main Author Lee, Sang Yeol
Format Journal Article
LanguageEnglish
Published Seoul The Korean Institute of Electrical and Electronic Material Engineers (KIEEME) 01.06.2020
한국전기전자재료학회
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ISSN1229-7607
2092-7592
DOI10.1007/s42341-020-00197-w

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Abstract Oxide materials are one of the most advanced key technology in the thin film transistors (TFTs) for the high-end of device applications. Amorphous oxide semiconductors (AOSs) have leading technique for flat panel display, active matrix organic light emitting display, active matrix liquid crystal display as well as thin film electronic devices due to their excellent electrical characteristics, such as field effect mobility ( μ FE ), subthreshold swing ( SS ) and threshold voltage ( V th ). Researchers from various fields have studied and considered ways to improve µ FE of AOS TFT, which has been studied for 16 years since 2004. Since 2004, mobility has been increased by using various methods, such as designing novel amorphous oxide materials, changing device structures, or adopting new post-treatment. The development of field effect mobility as well as the stability enhancement has been comprehensively reviewed in this report.
AbstractList Oxide materials are one of the most advanced key technology in the thin film transistors (TFTs) for the high-end of device applications. Amorphous oxide semiconductors (AOSs) have leading technique for fl at panel display, active matrix organic light emitting display, active matrix liquid crystal display as well as thin fi lm electronic devices due to their excellent electrical characteristics, such as fi eld eff ect mobility ( μ FE ), subthreshold swing ( SS ) and threshold voltage ( V th ). Researchers from various fi elds have studied and considered ways to improve μ FE of AOS TFT, which has been studied for 16 years since 2004. Since 2004, mobility has been increased by using various methods, such as designing novel amorphous oxide materials, changing device structures, or adopting new post-treatment. The development of field eff ect mobility as well as the stability enhancement has been comprehensively reviewed in this report. KCI Citation Count: 6
Oxide materials are one of the most advanced key technology in the thin film transistors (TFTs) for the high-end of device applications. Amorphous oxide semiconductors (AOSs) have leading technique for flat panel display, active matrix organic light emitting display, active matrix liquid crystal display as well as thin film electronic devices due to their excellent electrical characteristics, such as field effect mobility ( μ FE ), subthreshold swing ( SS ) and threshold voltage ( V th ). Researchers from various fields have studied and considered ways to improve µ FE of AOS TFT, which has been studied for 16 years since 2004. Since 2004, mobility has been increased by using various methods, such as designing novel amorphous oxide materials, changing device structures, or adopting new post-treatment. The development of field effect mobility as well as the stability enhancement has been comprehensively reviewed in this report.
Author Lee, Sang Yeol
Author_xml – sequence: 1
  givenname: Sang Yeol
  surname: Lee
  fullname: Lee, Sang Yeol
  email: sylee@cju.ac.kr
  organization: Department of Semiconductor Engineering, Cheongju University
BackLink https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART002595295$$DAccess content in National Research Foundation of Korea (NRF)
BookMark eNp9kE1PAjEQQBuDiYj8AU979bA6_diWHgkRxZCYKJ6bbulKhW1Ju4D-e6t48sBpksl7M8m7RD0fvEXoGsMtBhB3iRHKcAkESgAsRXk4Q30CkpSikqSH-pgQWQoO4gINU3I1UFnxTPI-epqEdhvtyvrk9rZ4sXtnD0XwxbgNcbsKu1Q8f7qlLV5t60zwy53pQiwWK-eLqdu0xSLqrKa8vELnjd4kO_ybA_Q2vV9MHsv588NsMp6XhkrclVxDzY3RDMSyaqjUsgamqeFUCo75qAK2bEayqqtmxBqCayNFLQXQjBAGjA7QzfGuj41aG6eCdr_zPah1VOOXxUxJxnklcGbJkTUxpBRto7bRtTp-KQzqJ546xlM5nvqNpw5ZGv2TjOt054Lvonab0yo9qin_8e82qo-wiz7nOGV9AwuSheM
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ContentType Journal Article
Copyright The Korean Institute of Electrical and Electronic Material Engineers 2020
Copyright_xml – notice: The Korean Institute of Electrical and Electronic Material Engineers 2020
DBID AAYXX
CITATION
ACYCR
DOI 10.1007/s42341-020-00197-w
DatabaseName CrossRef
Korean Citation Index
DatabaseTitle CrossRef
DatabaseTitleList

DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2092-7592
EndPage 248
ExternalDocumentID oai_kci_go_kr_ARTI_9466571
10_1007_s42341_020_00197_w
GroupedDBID -EM
.UV
0R~
406
9ZL
AACDK
AAHNG
AAJBT
AASML
AATNV
ABAKF
ABDZT
ABECU
ABFTV
ABKCH
ABMQK
ABTEG
ABTKH
ACAOD
ACDTI
ACHSB
ACOKC
ACPIV
ACZOJ
ADRFC
ADURQ
ADYFF
AEFQL
AEMSY
AESKC
AGDGC
AGJBK
AGMZJ
AGQEE
AIAKS
AIGIU
AILAN
AITGF
AJZVZ
ALMA_UNASSIGNED_HOLDINGS
AMKLP
AMXSW
AXYYD
BGNMA
DPUIP
EBLON
EBS
EJD
FIGPU
FINBP
FNLPD
FSGXE
HZB
IKXTQ
IWAJR
J-C
JDI
JZLTJ
KOV
LLZTM
M4Y
NPVJJ
NQJWS
NU0
O9J
OK1
PT4
RNS
ROL
RSV
SJYHP
SNE
SNPRN
SOHCF
SOJ
SRMVM
SSLCW
STPWE
UOJIU
UTJUX
VEKWB
VFIZW
ZMTXR
AAYXX
ABBRH
ABDBE
ABFSG
ACSTC
AEZWR
AFDZB
AFHIU
AHPBZ
AHWEU
AIXLP
ATHPR
AYFIA
CITATION
ACYCR
ID FETCH-LOGICAL-c391t-6a0b6cca407d5f39a9b04a3c63976168504df895b5f84f21bc97b97033c624043
ISSN 1229-7607
IngestDate Sun Mar 09 07:50:43 EDT 2025
Tue Jul 01 04:25:01 EDT 2025
Thu Apr 24 23:10:30 EDT 2025
Fri Feb 21 02:31:02 EST 2025
IsPeerReviewed true
IsScholarly true
Issue 3
Keywords Comprehensive review
Mobility
Amorphous oxide semiconductor
Thin film transistor
Stability
Language English
LinkModel OpenURL
MergedId FETCHMERGED-LOGICAL-c391t-6a0b6cca407d5f39a9b04a3c63976168504df895b5f84f21bc97b97033c624043
PageCount 14
ParticipantIDs nrf_kci_oai_kci_go_kr_ARTI_9466571
crossref_primary_10_1007_s42341_020_00197_w
crossref_citationtrail_10_1007_s42341_020_00197_w
springer_journals_10_1007_s42341_020_00197_w
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2020-06-01
PublicationDateYYYYMMDD 2020-06-01
PublicationDate_xml – month: 06
  year: 2020
  text: 2020-06-01
  day: 01
PublicationDecade 2020
PublicationPlace Seoul
PublicationPlace_xml – name: Seoul
PublicationTitle Transactions on electrical and electronic materials
PublicationTitleAbbrev Trans. Electr. Electron. Mater
PublicationYear 2020
Publisher The Korean Institute of Electrical and Electronic Material Engineers (KIEEME)
한국전기전자재료학회
Publisher_xml – name: The Korean Institute of Electrical and Electronic Material Engineers (KIEEME)
– name: 한국전기전자재료학회
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SSID ssib039560196
ssj0000314789
Score 2.4216096
SecondaryResourceType review_article
Snippet Oxide materials are one of the most advanced key technology in the thin film transistors (TFTs) for the high-end of device applications. Amorphous oxide...
SourceID nrf
crossref
springer
SourceType Open Website
Enrichment Source
Index Database
Publisher
StartPage 235
SubjectTerms Chemistry and Materials Science
Electronics and Microelectronics
Instrumentation
Materials Science
Optical and Electronic Materials
Review Paper
전기공학
Title Comprehensive Review on Amorphous Oxide Semiconductor Thin Film Transistor
URI https://link.springer.com/article/10.1007/s42341-020-00197-w
https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART002595295
Volume 21
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
ispartofPNX Transactions on Electrical and Electronic Materials, 2020, 21(3), , pp.235-248
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1bb9MwFLZK9wIPiKsoN0UIP41MjmMn8WPSphqTGC-dtLcodhKotqao6zTED-J3cnxJ2lKYBi-RdeQ49TnH9ndq-zsIvU9iBVFAmfhNXEGAAgDCTySpfMmVaJSomDI7-J9Oo-MzdnLOzweDn1unlq7X8kj9-OO9kv-xKsjArvqW7D9Ytm8UBFAG-8ITLAzPO9lYD-ZV_dWdQXcc-WDOdLEE9enDrZ-_z6saJoQFGLzV1K7LlUnVeTidXy4ss3lHONxj1NkmhbjZS7CZcnpWga3EOYB2bTc7s-F8jMUEZ0wXkhBgKs4znBLsGB7d3wuUbI5BGYfA-QQLjsUY5ynOOE4nugF4L2FGkuCMbEngIzkWxBXSsfkIfG3ctSNMIQXJ1qRLqfDjyGa_PaqNjBIByJ_bPHnd5GqJTdw6TS1D594SYE99XAFMZIFvOgQoNvZvNgtet8n_2zq4w7h9oebFl2VxsSogrvhYaBZ-rqkKDiiEI2SIDtJplp12M1eoo8zAERcaDBAGLDb5F_vOuRtb5t7m3o_bQUX32lWztzFv8M7sEXroAhUvtV73GA3q9gl6sEVf-RSd7PifZ_3PW7Ze73-e8T9vx_887X-e9j9v43_P0Nk0n42PfZebw1ehCNZ-VBIZwehnJK54E4pSSMLKUOl94iiIEk5Y1SSCS94krKGBVCKWApYXqEI1o9NzNGyXbf0CeZSUZV1DdQ3eqWhEzAPFKZOMNhWVZISCTjeFcsT1On_KZdFTbht9FqDPwuizuBmhw_6db5a25dba70DlxuZ_t_0IfegsUrg54OqWNl_epc1X6P5mzL1Gw_Xqun4DIHct3zoP-wUJIZTO
linkProvider Library Specific Holdings
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Comprehensive+Review+on+Amorphous+Oxide+Semiconductor+Thin+Film+Transistor&rft.jtitle=Transactions+on+electrical+and+electronic+materials&rft.au=%EC%9D%B4%EC%83%81%EB%A0%AC&rft.date=2020-06-01&rft.pub=%ED%95%9C%EA%B5%AD%EC%A0%84%EA%B8%B0%EC%A0%84%EC%9E%90%EC%9E%AC%EB%A3%8C%ED%95%99%ED%9A%8C&rft.issn=1229-7607&rft.eissn=2092-7592&rft.spage=235&rft.epage=248&rft_id=info:doi/10.1007%2Fs42341-020-00197-w&rft.externalDBID=n%2Fa&rft.externalDocID=oai_kci_go_kr_ARTI_9466571
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1229-7607&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1229-7607&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1229-7607&client=summon