APA (7th ed.) Citation

Marks, M. R., Cheong, K. Y., & Hassan, Z. (2022). A review of laser ablation and dicing of Si wafers. Precision engineering, 73, 377-408. https://doi.org/10.1016/j.precisioneng.2021.10.001

Chicago Style (17th ed.) Citation

Marks, Michael Raj, Kuan Yew Cheong, and Zainuriah Hassan. "A Review of Laser Ablation and Dicing of Si Wafers." Precision Engineering 73 (2022): 377-408. https://doi.org/10.1016/j.precisioneng.2021.10.001.

MLA (9th ed.) Citation

Marks, Michael Raj, et al. "A Review of Laser Ablation and Dicing of Si Wafers." Precision Engineering, vol. 73, 2022, pp. 377-408, https://doi.org/10.1016/j.precisioneng.2021.10.001.