Mechanistic Studies of Cu Electropolishing in Phosphoric Acid Electrolytes

• Published in: Journal of the Electrochemical Society Vol. 151; no. 6; pp. C375 - C378
• Main Authors: Du, Bing, Suni, Ian Ivar
• Format: Journal Article
• Language: English
• Published: Pennington, NJ Electrochemical Society 2004
• Subjects: Cross-disciplinary physics: materials science; rheology; Exact sciences and technology; Materials science; Physics; Surface treatments; Phosphoric acid; Aqueous solutions; Transition elements; Electropolishing; Surface treatments; Diffusion coefficient; Copper; Kinematic viscosity; Current density

Electropolishing of Cu and Cu/Ta/Si wafer samples were studied using a rotating disk electrode in a variety of phosphoric acid-based electrolytes, including several with ethanol and other species added as diluents. Diluents allow a wide range of water concentrations to be accessed and also reduce th...