Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm) - Zhang, Liang; Liu, Zhi-quan (Journal of materials science. Materials in electronics, 2020)
Keywords: Bonded joints; Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Diameters; Diffusion coefficient; Electronic packaging; Interface reactions; Interfaces; Intermetallic compounds; Liquid phases; Materials Science; Optical and Electronic Materials; Reaction kinetics; Tin; Transient liquid phase bonding