Corrosion behavior of Sn-based lead-free solder alloys: a review

• Published in: Journal of materials science. Materials in electronics Vol. 31; no. 12; pp. 9076 - 9090
• Main Authors: Li, Shuai, Wang, Xingxing, Liu, Zhongying, Jiu, Yongtao, Zhang, Shuye, Geng, Jinfeng, Chen, Xiaoming, Wu, Shengjin, He, Peng, Long, Weimin
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.06.2020; Springer Nature B.V
• Subjects: Alloy development; Alloying elements; Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Corrosion; Corrosion mechanisms; Corrosion products; Corrosion resistance; Corrosion resistant alloys; Lead free; Materials Science; Miniaturization; Morphology; Optical and Electronic Materials; Reliability aspects; Review; Silver; Temperature; Tin; Tin base alloys

Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic product...