Compact thermal networks for modeling packages - Codecasa, L.; D'Amore, D.; Maffezzoni, P. (IEEE transactions on components and packaging technologies, 2004)
Keywords: Algorithm design and analysis; Algorithms; Arrays; Boundary conditions; Electronics packaging; Equations; Matching; Mathematical models; Networks; Packages; Packaging; Power generation; Shape; State-space methods; Temperature distribution; Thermal conductivity; Vectors