High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

• Published in: Journal of materials science. Materials in electronics Vol. 29; no. 3; pp. 1785 - 1797
• Main Authors: Chen, Chuantong, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro
• Format: Journal Article
• Language: English
• Published: New York Springer US 01.02.2018; Springer Nature B.V
• Subjects: Bonding strength; Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Diffusion layers; Electrical resistivity; Electroplating; Gold; Grain structure; High temperature; Materials Science; Metallizing; Optical and Electronic Materials; Shear strength; Silver; Sintering; Soldering; Substrates; Thermal conductivity

Ag sinter joining technology has been used in the advanced power applications to replace conventional soldering technology due to its high temperature stability, along with its excellent electrical and thermal conductivity. In this paper, we report the high-temperature reliability (250 °C for 1000 h...