High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates - Chen, Chuantong; Suganuma, Katsuaki; Iwashige, Tomohito; Sugiura, Kazuhiko; Tsuruta, Kazuhiro (Journal of materials science. Materials in electronics, 2018)
Keywords: Bonding strength; Characterization and Evaluation of Materials; Chemistry and Materials Science; Copper; Diffusion layers; Electrical resistivity; Electroplating; Gold; Grain structure; High temperature; Materials Science; Metallizing; Optical and Electronic Materials; Shear strength; Silver; Sintering; Soldering; Substrates; Thermal conductivity