Mechanical Property Characterization of Boron-Doped Silicon by Berkovich-Type Indenter
The “true-hardness” of (100) single-crystal silicon has been measured as a function of boron doping concentration by nanoindentation with a pointed diamond indenter (Berkovich triangular pyramid). The boron-ion implanted silicon wafers in which the boron concentration is varied up to 2.0×10 20 cm -3...
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Published in | Japanese Journal of Applied Physics Vol. 40; no. 3A; p. L183 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
01.03.2001
|
Online Access | Get full text |
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Abstract | The “true-hardness” of (100) single-crystal silicon has been measured as a function of boron doping concentration by nanoindentation with a pointed diamond indenter (Berkovich triangular pyramid). The boron-ion implanted silicon wafers in which the boron concentration is varied up to 2.0×10
20
cm
-3
are studied. The results reveal an increase in the hardness at high boron concentrations, and a hardness ratio of 1.5:1 between the heavily and lightly boron-doped silicon has been obtained. |
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AbstractList | The “true-hardness” of (100) single-crystal silicon has been measured as a function of boron doping concentration by nanoindentation with a pointed diamond indenter (Berkovich triangular pyramid). The boron-ion implanted silicon wafers in which the boron concentration is varied up to 2.0×10
20
cm
-3
are studied. The results reveal an increase in the hardness at high boron concentrations, and a hardness ratio of 1.5:1 between the heavily and lightly boron-doped silicon has been obtained. |
Author | Takashi Jimbo, Takashi Jimbo Junji Watanabe, Junji Watanabe Katsutoshi Izumi, Katsutoshi Izumi Guolin Yu, Guolin Yu Kenshiro Nakashima, Kenshiro Nakashima Masayoshi Umeno, Masayoshi Umeno |
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Cites_doi | 10.1016/0020-7683(92)90004-D 10.1557/JMR.1998.0252 10.1149/1.2086278 10.1557/JMR.1992.0450 10.1016/0956-7151(93)90194-W 10.1016/S0924-4247(97)80047-7 10.1103/RevModPhys.65.163 10.1021/cr00017a020 10.1016/S0040-6090(96)09143-2 10.1063/1.112059 10.1557/JMR.1999.0310 10.1016/S0022-0248(98)00262-0 |
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