Ko, E., Yi, K., Park, J., Cho, J. W., & Shin, H. (2010). Numerical modeling and analysis of the thermal behavior of copper molds in continuous casting. Metals and materials international, 16(2), 281-288. https://doi.org/10.1007/s12540-010-0418-8
Chicago Style (17th ed.) CitationKo, Eun-yi, Kyung-Woo Yi, Joong-kil Park, Jung Wook Cho, and Ho-Jung Shin. "Numerical Modeling and Analysis of the Thermal Behavior of Copper Molds in Continuous Casting." Metals and Materials International 16, no. 2 (2010): 281-288. https://doi.org/10.1007/s12540-010-0418-8.
MLA (9th ed.) CitationKo, Eun-yi, et al. "Numerical Modeling and Analysis of the Thermal Behavior of Copper Molds in Continuous Casting." Metals and Materials International, vol. 16, no. 2, 2010, pp. 281-288, https://doi.org/10.1007/s12540-010-0418-8.