Thermal analysis of an LED module with a novelly assembled heat pipe heat sink

• Published in: Journal of Central South University Vol. 24; no. 4; pp. 921 - 928
• Main Authors: Tang, Yong, Chen, Qiu, Guan, Wo-huan, Li, Zong-tao, Yu, Bin-hai, Yuan, Wei
• Format: Journal Article
• Language: English
• Published: Changsha Central South University 01.04.2017; Springer Nature B.V
• Subjects: Engineering; Heat pipes; Heat sinks; Heat transfer; Light emitting diodes; Metallic Materials; Modules; Thermal analysis; Thermal resistance; heat sink; light emitting diode (LED); phase change assembly; heat pipe; thermal analysis

This work aims to improve the thermal performance of a light emitting diode (LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly (PCEA) process, which was developed by both finite element (FE) analysis a...