The impact of polishing on germanium-on-insulator substrates - 林旺 阮育娇 陈松岩 李成 赖虹凯 黄巍 (Journal of semiconductors, 2013)
Keywords: Bonding; Bonding strength; Chemical-mechanical polishing; Crystals; Germanium; Mechanical polishing; Polishing; Semiconductors; X射线衍射; 化学机械抛光; 基板; 研磨方法; 粘接强度; 绝缘体; 锗; 键合技术