A review: On the development of low melting temperature Pb-free solders

• Published in: Microelectronics and reliability Vol. 54; no. 6-7; pp. 1253 - 1273
• Main Authors: Kotadia, Hiren R., Howes, Philip D., Mannan, Samjid H.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.06.2014; Elsevier
• Subjects: Applied sciences; Complex systems; Cross-disciplinary physics: materials science; rheology; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Interconnections; Interface reactions; Interfacial reactions; Intermetallic compounds; Lead (metal); Lead-free solder; Legislation; Materials science; Microelectronic fabrication (materials and surfaces technology); Nanocomposite solders; Nanoscale materials and structures: fabrication and characterization; Other topics in nanoscale materials and structures; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Soldering; Solders; Tin; Europe; Nanocomposite solders; Lead-free solder; Intermetallic compounds; Soldering; Interfacial reactions; Nanoparticle; Legislation; Complex system; Metallizing; Common base; Solder metal; Alloying element; Coatings; Solidification; Prospective; Integrated circuit bonding; Additive; Microelectronic fabrication; Interconnection; Soldered joint; Integrated circuit; Lead free soldering; Interface reaction; Low temperature

Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established ben...