A review: On the development of low melting temperature Pb-free solders - Kotadia, Hiren R.; Howes, Philip D.; Mannan, Samjid H. (Microelectronics and reliability, 2014)
Keywords: Applied sciences; Complex systems; Cross-disciplinary physics: materials science; rheology; Design. Technologies. Operation analysis. Testing; Electronics; Exact sciences and technology; Integrated circuits; Interconnections; Interface reactions; Interfacial reactions; Intermetallic compounds; Lead (metal); Lead-free solder; Legislation; Materials science; Microelectronic fabrication (materials and surfaces technology); Nanocomposite solders; Nanoscale materials and structures: fabrication and characterization; Other topics in nanoscale materials and structures; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Soldering; Solders; Tin; Europe; Nanocomposite solders; Lead-free solder; Intermetallic compounds; Soldering; Interfacial reactions; Nanoparticle; Legislation; Complex system; Metallizing; Common base; Solder metal; Alloying element; Coatings; Solidification; Prospective; Integrated circuit bonding; Additive; Microelectronic fabrication; Interconnection; Soldered joint; Integrated circuit; Lead free soldering; Interface reaction; Low temperature