A review: On the development of low melting temperature Pb-free solders
Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established ben...
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| Published in | Microelectronics and reliability Vol. 54; no. 6-7; pp. 1253 - 1273 |
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| Main Authors | , , |
| Format | Journal Article |
| Language | English |
| Published |
Kidlington
Elsevier Ltd
01.06.2014
Elsevier |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established benchmarks set by leaded solders and improve on the current generation of Pb free solders such as SAC105 and SAC305. Although this poses a great challenge to researchers around the world, significant progress is being made in developing new solder alloys with promising properties. In this review, we discuss fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems. We first explain the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements. We also discuss the continued improvement of substrate resistance to attack from molten Sn which will help maintain the interface stability of interconnections. Finally, we discuss the various studies which have looked at employing nanoparticles as solder additives, and the future prospects of this field. |
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| AbstractList | Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established benchmarks set by leaded solders and improve on the current generation of Pb free solders such as SAC105 and SAC305. Although this poses a great challenge to researchers around the world, significant progress is being made in developing new solder alloys with promising properties. In this review, we discuss fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems. We first explain the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements. We also discuss the continued improvement of substrate resistance to attack from molten Sn which will help maintain the interface stability of interconnections. Finally, we discuss the various studies which have looked at employing nanoparticles as solder additives, and the future prospects of this field. |
| Author | Howes, Philip D. Mannan, Samjid H. Kotadia, Hiren R. |
| Author_xml | – sequence: 1 givenname: Hiren R. surname: Kotadia fullname: Kotadia, Hiren R. email: hkotadia@gmail.com organization: Department of Physics, King’s College London, Strand, London WC2R 2LS, UK – sequence: 2 givenname: Philip D. surname: Howes fullname: Howes, Philip D. organization: Department of Materials, Imperial College London, Exhibition Road, London SW7 2AZ, UK – sequence: 3 givenname: Samjid H. surname: Mannan fullname: Mannan, Samjid H. organization: Department of Physics, King’s College London, Strand, London WC2R 2LS, UK |
| BackLink | http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28559319$$DView record in Pascal Francis |
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| CODEN | MCRLAS |
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| Keywords | Nanocomposite solders Lead-free solder Intermetallic compounds Soldering Interfacial reactions Nanoparticle Legislation Complex system Metallizing Common base Solder metal Alloying element Coatings Solidification Prospective Integrated circuit bonding Additive Microelectronic fabrication Interconnection Soldered joint Integrated circuit Lead free soldering Interface reaction Low temperature |
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| Snippet | Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and... |
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| SubjectTerms | Applied sciences Complex systems Cross-disciplinary physics: materials science; rheology Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Interconnections Interface reactions Interfacial reactions Intermetallic compounds Lead (metal) Lead-free solder Legislation Materials science Microelectronic fabrication (materials and surfaces technology) Nanocomposite solders Nanoscale materials and structures: fabrication and characterization Other topics in nanoscale materials and structures Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solders Tin |
| Title | A review: On the development of low melting temperature Pb-free solders |
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