Kaur, R., Bansal, B., Majhi, S., Jain, S., Huang, C., & Yuen, C. (2024). A Survey on Reconfigurable Intelligent Surface for Physical Layer Security of Next-Generation Wireless Communications. IEEE open journal of vehicular technology, 5, 172-199. https://doi.org/10.1109/OJVT.2023.3348658
Chicago Style (17th ed.) CitationKaur, Ravneet, Bajrang Bansal, Sudhan Majhi, Sandesh Jain, Chongwen Huang, and Chau Yuen. "A Survey on Reconfigurable Intelligent Surface for Physical Layer Security of Next-Generation Wireless Communications." IEEE Open Journal of Vehicular Technology 5 (2024): 172-199. https://doi.org/10.1109/OJVT.2023.3348658.
MLA (9th ed.) CitationKaur, Ravneet, et al. "A Survey on Reconfigurable Intelligent Surface for Physical Layer Security of Next-Generation Wireless Communications." IEEE Open Journal of Vehicular Technology, vol. 5, 2024, pp. 172-199, https://doi.org/10.1109/OJVT.2023.3348658.