Hybrid Photonic Integrated Circuits for Wireless Transceivers

Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si3N4) low-l...

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Published inPhotonics Vol. 12; no. 4; p. 371
Main Authors Qian, Tianwen, Schuler, Ben, Gupta, Y. Durvasa, Deumer, Milan, Andrianopoulos, Efstathios, Lyras, Nikolaos K., Kresse, Martin, Weigel, Madeleine, Reck, Jakob, Mihov, Klara, Winklhofer, Philipp, Keuer, Csongor, Emden, Laurids von, Amberg, Marcel, Zawadzki, Crispin, Kleinert, Moritz, Nellen, Simon, Felipe, Davide de, Avramopoulos, Hercules, Kohlhaas, Robert B., Keil, Norbert, Schell, Martin
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Published Basel MDPI AG 01.04.2025
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Abstract Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si3N4) low-loss waveguides, and high-efficient thermal-optical tunable polymers with micro-optical functions to achieve fully integrated wireless transceivers. Key contributions include (1) On-chip optical injection locking for generating phase-locked optical beat notes at 45 GHz, enabled by cascaded InP phase modulators and hybrid InP/polymer tunable lasers with a 3.8 GHz locking range. (2) Waveguide-integrated THz emitters and receivers, featuring photoconductive antennas (PCAs) with a 22× improved photoresponse compared to top-illuminated designs, alongside scalable 1 × 4 PIN-PD and PCA arrays for enhanced power and directivity. (3) Beam steering at 300 GHz using a polymer-based optical phased array (OPA) integrated with an InP antenna array, achieving continuous steering across 20° and a 10.6 dB increase in output power. (4) Demonstration of fully integrated hybrid wireless transceiver PICs combining InP, Si3N4, and polymer material platforms, validated through key component characterization, on-chip optical frequency comb generation, and coherent beat note generation at 45 GHz. These advancements result in compact form factors, reduced power consumption, and enhanced scalability, positioning PICs as an enabling technology for future high-speed wireless networks.
AbstractList Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si[sub.3]N[sub.4]) low-loss waveguides, and high-efficient thermal-optical tunable polymers with micro-optical functions to achieve fully integrated wireless transceivers. Key contributions include (1) On-chip optical injection locking for generating phase-locked optical beat notes at 45 GHz, enabled by cascaded InP phase modulators and hybrid InP/polymer tunable lasers with a 3.8 GHz locking range. (2) Waveguide-integrated THz emitters and receivers, featuring photoconductive antennas (PCAs) with a 22× improved photoresponse compared to top-illuminated designs, alongside scalable 1 × 4 PIN-PD and PCA arrays for enhanced power and directivity. (3) Beam steering at 300 GHz using a polymer-based optical phased array (OPA) integrated with an InP antenna array, achieving continuous steering across 20° and a 10.6 dB increase in output power. (4) Demonstration of fully integrated hybrid wireless transceiver PICs combining InP, Si[sub.3]N[sub.4], and polymer material platforms, validated through key component characterization, on-chip optical frequency comb generation, and coherent beat note generation at 45 GHz. These advancements result in compact form factors, reduced power consumption, and enhanced scalability, positioning PICs as an enabling technology for future high-speed wireless networks.
Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si3N4) low-loss waveguides, and high-efficient thermal-optical tunable polymers with micro-optical functions to achieve fully integrated wireless transceivers. Key contributions include (1) On-chip optical injection locking for generating phase-locked optical beat notes at 45 GHz, enabled by cascaded InP phase modulators and hybrid InP/polymer tunable lasers with a 3.8 GHz locking range. (2) Waveguide-integrated THz emitters and receivers, featuring photoconductive antennas (PCAs) with a 22× improved photoresponse compared to top-illuminated designs, alongside scalable 1 × 4 PIN-PD and PCA arrays for enhanced power and directivity. (3) Beam steering at 300 GHz using a polymer-based optical phased array (OPA) integrated with an InP antenna array, achieving continuous steering across 20° and a 10.6 dB increase in output power. (4) Demonstration of fully integrated hybrid wireless transceiver PICs combining InP, Si3N4, and polymer material platforms, validated through key component characterization, on-chip optical frequency comb generation, and coherent beat note generation at 45 GHz. These advancements result in compact form factors, reduced power consumption, and enhanced scalability, positioning PICs as an enabling technology for future high-speed wireless networks.
Audience Academic
Author Mihov, Klara
Zawadzki, Crispin
Felipe, Davide de
Andrianopoulos, Efstathios
Schuler, Ben
Reck, Jakob
Nellen, Simon
Keil, Norbert
Lyras, Nikolaos K.
Kleinert, Moritz
Deumer, Milan
Qian, Tianwen
Emden, Laurids von
Weigel, Madeleine
Avramopoulos, Hercules
Kresse, Martin
Kohlhaas, Robert B.
Winklhofer, Philipp
Amberg, Marcel
Schell, Martin
Gupta, Y. Durvasa
Keuer, Csongor
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Snippet Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer...
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StartPage 371
SubjectTerms Antenna arrays
Antennas
Antennas (Electronics)
Bandwidths
Beam steering
Directivity
Emitters
Energy conservation
Form factors
Frequency locking
high-speed wireless communication
hybrid integration
Indium phosphides
Innovations
Integrated circuits
Lasers
Nitrides
Optical frequency
Optics
Phased arrays
photonic integrated circuits
Photonics
Photoresponse
Polymers
Power consumption
Power management
Receivers & amplifiers
Semiconductor chips
Semiconductors
Silicon nitride
Transceivers
Tunable lasers
Waveguides
Wireless carriers
Wireless communications
Wireless networks
wireless transceivers
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Title Hybrid Photonic Integrated Circuits for Wireless Transceivers
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