Reliability challenges in 3D IC packaging technology

• Published in: Microelectronics and reliability Vol. 51; no. 3; pp. 517 - 523
• Main Author: Tu, K.N.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.03.2011; Elsevier
• Subjects: Applied sciences; Design. Technologies. Operation analysis. Testing; Electromigration; Electronics; Exact sciences and technology; Integrated circuits; Microelectronics; Packaging; Projection; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Temperature gradient; Thermomigration; Three dimensional; Thermal diffusion; Interconnection; Electronic packaging; Integrated circuit; Flip-chip; Electrodiffusion; Microelectronics; Reliability; Joule effect; Temperature gradient

At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order to remove heat, a...